• Supplied in tape and reel packaging, 2000 per 13” diameter reel
Product Specifications
Part Number
SD6030-2R7-R
SD6030-3R3-R
SD6030-4R2-R
SD6030-5R0-R
SD6030-5R8-R
SD6030-7R8-R
SD6030-100-R
SD6030-120-R
SD6030-150-R
SD6030-180-R
SD6030-220-R
SD6030-270-R
SD6030-330-R
SD6030-360-R
SD6030-440-R
SD6030-520-R
SD6030-680-R
SD6030-820-R
SD6030-101-R
SD6030-121-R
SD6030-151-R
SD6030-181-R
SD6030-221-R
SD6030-271-R
SD6030-331-R
SD6030-391-R
SD6030-471-R
SD6030-561-R
SD6030-681-R
5
OCL µH ± 30%
2.7
3.3
4.1
4.9
5.8
7.8
9.3
11.3
14.1
17.1
20.4
26.0
32.4
34.4
44.0
52.0
65.6
81.6
94.4
110.1
144.5
175.7
210.9
264.2
313.5
373.7
460.0
546.2
659.4
1
I
rms
(Amps)
4.08
3.54
3.11
2.81
2.58
2.38
2.15
1.99
1.71
1.65
1.57
1.31
1.26
1.19
1.10
0.99
0.92
0.80
0.76
0.70
0.64
0.55
0.50
0.44
0.38
0.35
0.33
0.30
0.27
2
I
sat
3
.(Amps)
2.60
2.40
2.20
1.90
1.80
1.60
1.30
1.20
1.10
1.00
0.90
0.85
0.75
0.70
0.62
0.58
0.52
0.46
0.42
0.40
0.35
0.32
0.30
0.27
0.25
0.22
0.20
0.18
0.16
Typ. DCR mW @ 20°C
13
18
23
28
33
39
48
56
76
82
90
130
140
157
185
226
263
343
385
517
608
817
1000
1300
1733
2083
2250
2767
3458
Max DCR mW @ 20°C
18
24
31
38
45
53
65
76
103
110
122
175
189
212
250
305
355
463
520
620
730
980
1200
1560
2080
2500
2700
3320
4150
K-factor
4
34
30
27
24
22
19
17
16
14
13
12
11
9.3
8.7
7.9
7.2
6.5
5.9
5.6
5.6
5.0
4.5
4.0
3.6
3.3
3.0
2.8
2.5
2.3
1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
2 Irms: DC current for an approximate
DT
of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions veri-
fied in the end application.
3 Isat Amps peak for 35% rolloff (@25°C)
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*DI, Bp-p (mT), K:
(K factor from table), L: (Inductance in
mH), DI
(Peak to peak ripple current in Amps).
5 Part Number Definition: SD6030-xxx-R
SD6030 = Product code and size; -xxx = Inductance value in
mH;
R = decimal point; If no R is present, third character = # of zeros.
-R suffix = RoHS compliant
1111
BU-SB111167
Page 1 of 4
Data Sheet: 4314
Dimensions - mm
Part Marking: Coiltronics logo, xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level.
Packaging Information - mm
Parts packaged on 13" diameter reel, 2000 parts per reel.
Core Loss
1
500kHz
300kHz
1MHz
200kHz
0.1
Core Loss (W)
100kHz
0.01
0.001
0.0001
1
10
Bp-p (mT)
100
1000
1111
BU-SB111167
Page 2 of 4
Data Sheet: 4314
Temperature Rise vs. Loss
Inductance Characteristics
-40°C
+25°C
+85°C
1111
BU-SB111167
Page 3 of 4
Data Sheet: 4314
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Volume
Package
mm
3
Thickness
<350
<1.6mm
260°C
1.6 – 2.5mm 260°C
>2.5mm
250°C
Time
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies Bussmann
Cooper
1225 Broken Sound Parkway NWP.O. Box 14460
Suite F
St. Louis, MO 63178?4460
Boca Raton, FL 33487?3533Tel: 1?636?394?2877
Tel: 1?561?998?4100
Fax: 1?636?527?1607
Fax: 1?561?241?6640
Toll Free: 1?888?414?2645
Asia Pacific
Europe
Cooper
Cooper Electronic Technologies Electronic Technologies Electronic Technologies
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