C1206X7R250-154JGR datasheet, PDF

C1206X7R250-154JGR: DescriptionCeramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.15uF, 1206,; CategoryPassive components capacitor; File Size901KB，29 Pages; ManufacturerVENKEL LTD; Environmental Compliance

Download Datasheet Parametric View All

C1206X7R250-154JGR Overview

Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.15uF, 1206,

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	7007414882
package instruction	, 1206
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	6.9
capacitance	0.15 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.8 mm
JESD-609 code	e4
length	3.2 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	TR, PAPER, 13 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	25 V
size code	1206
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Gold (Au) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm

(Transfer) Overview of CC2640R2F BLE5.0 Bluetooth Protocol Stack: [align=left][b][font=宋体][size=16.0pt]Overview[/size][/font][/b][/align][align=left]This section introduces the Bluetooth protocol stack functions and interfaces in detail. The protocol stack project i...; freebsder RF/Wirelessly

Small base stations, big science!: On July 19, China Mobile announced the winning bidders for the "5G 700MHz Wireless Network Main Equipment Centralized Procurement". The products to be procured this time are 5G 700MHz macro base stati...; 兰博 RF/Wirelessly

IP Design Specifications in the 2021 Standard for Very Large Scale Integrated Circuit (VLSI) Design Flow: In the modern semiconductor industry, VLSI design methods based on IP (intellectual property) are a development trend, which is very important for enhancing the production capacity of VLSI chips. The ...; modemdesign EE_FPGA Learning Park

ST60 short-distance contactless 60GHz millimeter wave connector actual test: [i=s]This post was last edited by x1816 on 2022-1-8 17:08[/i]Previous story: See the unboxing and analysis post https://en.eeworld.com/bbs/thread-1191435-1-1.htmlTest environment introductionThe test ...; x1816 RF/Wirelessly

[ST NUCLEO-H743ZI Review] Establishing a modbus/TCP slave: MODBUS communication protocol is widely used because it is open, has no copyright requirements, is easy to deploy and maintain. Focusing on the evaluation of NUCLEO-H743, the modbus communication prot...; 54chenjq stm32/stm8

What is a bypass capacitor? What is a decoupling capacitor? What are their differences and connections?: [b][font=宋体][size=5][color=#0000ff]1. Bypass Capacitor[/color][/size] [/font][/b][align=left][color=rgb(34, 34, 34)][font=宋体][size=4]In a circuit, if you want to remove signals above a certain frequen...; tiankai001 Analog electronics

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components