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1PMT4622DE3

Description
Zener Diode, 3.9V V(Z), 1%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2
CategoryDiscrete semiconductor    diode   
File Size111KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

1PMT4622DE3 Overview

Zener Diode, 3.9V V(Z), 1%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2

1PMT4622DE3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeDO-216
package instructionS-PSSO-G1
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Other featuresLOW NOISE
Shell connectionCATHODE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance1650 Ω
JEDEC-95 codeDO-216AA
JESD-30 codeS-PSSO-G1
JESD-609 codee3
Number of components1
Number of terminals1
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage3.9 V
surface mountYES
technologyZENER
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperature40
Maximum voltage tolerance1%
Working test current0.25 mA
Base Number Matches1
1PMT4614e3 thru 1PMT4627e3,
1PMT4099e3 thru 1PMT4135e3
SCOTTSDALE DIVISION
POWERMITE
TM
Low Noise 1 Watt Zener Diodes
DESCRIPTION
This Microsemi Powermite
®
surface mount low noise Zener package series
provides a higher power handling capability that are also RoHS compliant.
In addition to its size advantages, Powermite
®
package features include a
full-metallic bottom that eliminates the possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an efficient heat path
from die to mounting plane for external heat sinking with very low thermal
resistance junction to case (bottom). Its innovative design makes this
device ideal for use with automatic insertion equipment.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-216
FEATURES
Surface mount equivalent to JEDEC registered
1N4099 thru 1N4135 and 1N4614 thru 1N4627
series except with additional power capability
RoHS compliant
Options for screening in accordance with Mil-PRF-
19500/435 for JAN, JANTX, JANTXV and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example,
designate MX1PMT4099 for a JANTX (consult factory
for Tin-Lead plating if required).
Optional 100% avionics screening available by
adding MA prefix for 100% temperature cycle,
thermal impedance, and 24 hour HTRB testing
(consult factory for Tin-Lead plating if required).
APPLICATIONS / BENEFITS
Extensive selection from 1.8 to 100 V
Regulates voltage over a broad operating current
and temperature range
Low noise density (1-3 kHz) at test current
Low reverse leakage current
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Compatible with automatic insertion equipment
Full metallic bottom eliminates flux entrapment
MAXIMUM RATINGS
Operating and Storage Temperatures: -55°C to +150°C
Steady-State Power: 1.0 watt at T
C
< 120
o
C where
T
C
is case bottom temperature at mounting plane, or
0.5 watts at T
A
= 30
º
C (ambient temperature) when
mounted on FR4 PC board as described for thermal
resistance (also see power deratings in Figure 1)
Thermal Resistance: 30°C/W junction to case
(bottom) and 240°C/W junction to ambient on FR4
PC board (1 oz copper) with recommended footprint
(see last page)
Forward voltage: 1.1 Volts @ 200 mA
Solder Temperatures: 260°C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting epoxy
compound meeting UL94V-0
FINISH: Annealed matte-Tin plating over copper and
readily solderable per MIL-STD-750 method 2026
(consult factory for Tin-Lead plating)
POLARITY: Cathode designated by Tab 1 (bottom)
MARKING: Three numerical digits of P/N and a dot
(see next page listing)
WEIGHT: 0.016 grams (approx.)
Package dimensions on last page
Tape & Reel option: Standard per EIA-481-B
3000 on 7 inch reel and 12,000 on 13” reel
1PMT4614-27 &
1PMT4099-4135
Copyright
©
2005
5-06-2005 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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