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U90-H1R1-100A

Description
I/O connectors qsfp cage assembly w/o light pipe
CategoryThe connector   
File Size198KB,2 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

U90-H1R1-100A Overview

I/O connectors qsfp cage assembly w/o light pipe

U90-H1R1-100A Parametric

Parameter NameAttribute value
ManufactureAmphenol
Product CategoryI/O Connectors
RoHSYes
ExpressPort QSFP+ / QSFP
TM
U90-C101-3000
The ExpressPort™ QSFP+/QSFP interconnect system is comprised of a 38-position 0.8 mm pitch SMT
connector, and a press- t cage designed to comply with the Quad Small Form-factor Pluggable (QSFP)
Transceiver intended for external connections. High speed serial interconnect applications include
clusters, servers, and storage devices.
The ExpressPort™ QSFP+ E-Series and H-Series connector families are rated to 28 Gbps and 40 Gbps
respectively per channel (4x28), featuring a stamped and formed contact design providing improved
mechanical durability. This connector features an integrated grounding structure and resonance
dampening features for superior crosstalk performance. The contact design is optimized for a smooth
impedance pro le resulting in improved SI performance.
Speci cation Highlights
The QSFP interconnect system is comprised of a
press- t cage assembly which is used with
38-position connectors complying with QSFP
Transceiver Speci cations.
Mechanical Characteristics
Cage is Keyed According to QSFP MSA
o
QSFP+: SFF-8436
o
E-Series: SFF-8672
o
H-Series: TBD
Durability: 250 Mating Cycles min
Connector Insertion Force: 40 N max
Connector Withdrawal Force: 30 N max
Electrical Characteristics
Hot Swappable
Operating Voltage: 30 V
Operating Current: 0.5 A
Differential Impedance: 100 Ω +/- 10 Ω
DWV: 300 V AC
Insulation Resistance: 1000 MΩ min
Contact Resistance: 70 mΩ max
Packaging
Tape and Reel Packaging: Connector
or 1x1 Cage
Tray Packaging: Cage of all Sizes
Bulk Packaging: Dust Cover
Temperature Rating
Operating Temperature: -40°C to +85°C
Storage Temperature: -40°C to +85°C
Con gurations
(Rows x Ports per Row)
• 1x1 • 1x2 • 1x3 • 1x4
Options
Dust Cover
Light Pipe
o
Round 1.4 mm
o
Square 2.6x2.6 mm
Heat Sink
Cage Design
o
Through or Behind the Bezel
1x6
Materials
Cage
o
Base Material: Copper Alloy
o
Plating: Nickel or Tin
o
Light Pipe: Optical Grade Polycarbonate
o
Heat Sink: Aluminum Alloy
o
Heat Sink Clip: Stainless Steel
o
Dust Cover: Thermoplastic
Connector
o
Contact Base Material: Copper Alloy
o
Contact Plating: Gold on Mating Area, Matte Tin
on Terminations and Grounding Tabs
o
Housings: Glass Reinforced, Lead-Free Solder
Reflow Process Compatible Thermoplastic,
UL94V-0 Rated
Signal Integrity Characteristics
QSFP, ExpressPort™ QSFP+
Return Loss: -12 dB
Near-End Isolation: -30 dB (frequencies up to 3 GHz)
Insertion Loss: -1 dB max
Rise Time for Impedance Measurement: 35 ps
Within Pair Skew: 1 ps
NEXT: ≤ 2%
ExpressPort™ QSFP+ E-Series Connector
Return Loss: -12 dB max (frequencies up to 14 GHz)
Insertion Loss: 1.4 dB max (frequencies up to 14 GHz)
Common Mode Conversion: -24 dB max (up to 14 GHz)
Integrated Crosstalk Noise: 3 mV rms
-
Assumes 3 Nearest-Neighbour (most detrimental)
Aggressor Parameters and Receiver Parameters:
o
Near- and Far-End Aggressors’ Peak Differential
Amplitude: 600 mV
o
Near- & Far-End Aggressors’ 20-80% Risetime: 9.6 ps
o
3 dB Reference Receiver Bandwidth: 18.75 GHz
o
Range of Integration: 10 MHz to 40 GHz
o
MDNEXT: 1 mV rms; MDFEXT: 2.8 mV rms
ExpressPort™ QSFP+ H-Series Connector
Return Loss: < -20 dB to 12GHz, -12 dB to 20GHz
Near End Isolation: -40 to 20 GHz
Insertion Loss: -1dB up to 20GHz
Differential Impedance:100 +/- 5 Ω at 35 ps
Within pair skew: <1 ps
12

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