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74HCT10PW,118

Description
logic gates triple 3-input nand
Categorylogic    logic   
File Size33KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT10PW,118 Overview

logic gates triple 3-input nand

74HCT10PW,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instructionTSSOP-14
Contacts14
Manufacturer packaging codeSOT402-1
Reach Compliance Codeunknow
seriesHCT
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Humidity sensitivity level1
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)36 ns
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT10
Triple 3-input NAND gate
Product specification
File under Integrated Circuits, IC06
December 1990

74HCT10PW,118 Related Products

74HCT10PW,118 74HC10DB,112 74HC10PW,118 74HCT10DB,112 74HCT10D,652 74HCT10D,653 74HCT10PW,112 74HC10D,653
Description logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand logic gates triple 3-input nand gate
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP NXP
Parts packaging code TSSOP SSOP1 TSSOP SSOP1 SOIC SOIC TSSOP SOIC
package instruction TSSOP-14 SSOP, SSOP14,.3 TSSOP, TSSOP14,.25 SSOP, SSOP14,.3 SOP, SOP14,.25 SOP, TSSOP, TSSOP14,.25 SO-14
Contacts 14 14 14 14 14 14 14 14
Manufacturer packaging code SOT402-1 SOT337-1 SOT402-1 SOT337-1 SOT108-1 SOT108-1 SOT402-1 SOT108-1
Reach Compliance Code unknow compli compli compli compliant compliant compliant compliant
series HCT HC/UH HC/UH HCT HCT HCT HCT HC/UH
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
length 5 mm 6.2 mm 5 mm 6.2 mm 8.65 mm 8.65 mm 5 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of functions 3 3 3 3 3 3 3 3
Number of entries 3 3 3 3 3 3 3 3
Number of terminals 14 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP TSSOP SSOP SOP SOP TSSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
propagation delay (tpd) 36 ns 29 ns 29 ns 36 ns 36 ns 36 ns 36 ns 29 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 2 mm 1.1 mm 2 mm 1.75 mm 1.75 mm 1.1 mm 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 6 V 6 V 5.5 V 5.5 V 5.5 V 5.5 V 6 V
Minimum supply voltage (Vsup) 4.5 V 2 V 2 V 4.5 V 4.5 V 4.5 V 4.5 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30
width 4.4 mm 5.3 mm 4.4 mm 5.3 mm 3.9 mm 3.9 mm 4.4 mm 3.9 mm
Base Number Matches 1 1 1 1 1 1 1 1
JESD-609 code e4 e4 e4 e4 e4 - e4 -
MaximumI(ol) - 0.004 A 0.004 A 0.004 A 0.004 A - 0.004 A 0.004 A
Encapsulate equivalent code - SSOP14,.3 TSSOP14,.25 SSOP14,.3 SOP14,.25 - TSSOP14,.25 SOP14,.25
power supply - 2/6 V 2/6 V 5 V 5 V - 5 V 2/6 V
Schmitt trigger - NO NO NO NO - NO NO

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