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MCIMX27VOP4A

Description
processors - application specialized I.mx27 rev 2.1
Categorysemiconductor    Other integrated circuit (IC)   
File Size2MB,152 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance  
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processors - application specialized I.mx27 rev 2.1

MCIMX27VOP4A Parametric

Parameter NameAttribute value
ManufactureFreescale Semiconduc
Product CategoryProcessors - Application Specialized
RoHSYes
TypeMultimedia Applications
CoreARM926EJ-S
Data Bus Width32 bi
Maximum Clock Frequency100 MHz
Operating Supply Voltage1.38 V to 1.52 V
Maximum Operating Temperature+ 105 C
Mounting StyleSMD/SMT
Package / CaseBGA-404
Memory TypeL1 Cache, ROM, SRAM
Minimum Operating Temperature- 20 C
Number of Timers6
PackagingTray
Processor Seriesi.MX27
Factory Pack Quantity90
Unit Weigh642.750 mg
Freescale Semiconductor
Technical Data
Document Number: MCIMX27EC
Rev. 1.8, 1/2013
i.MX27 and i.MX27L
i.MX27 and i.MX27L
Data Sheet
Multimedia Applications
Processor
1
Introduction
1.
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Case 1931-04
(MAPBGA-473)
Ordering Information
See
Table 1 on page 4
for ordering information.
The i.MX27 and i.MX27L (MCIMX27/MX27L)
multimedia applications processors represents the next
step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX27 and
i.MX27L processors and referred to singularly
throughout this document as i.MX27.
The i.MX27L does not include the following features:
ATA-6 HDD Interface, Memory Stick Pro, VPU:
MPEG-4/ H.263/H.264 HW encoder/decoder, and
eMMA (PrP processing, CSC, deblock, dering).
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27/27L processor provides the performance with
low power consumption required by modern digital
devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
2.
3.
4.
5.
6.
7.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description and Application Information . . . . 4
2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4
2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35
3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 35
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 40
4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40
4.2. Module-Level Electrical Specifications . . . . . . . . 43
4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54
Package Information and Pinout . . . . . . . . . . . . . . . . 109
5.1. Full Package Outline Drawing (17 mm
× 17
mm) 109
5.2. Pin Assignments (17 mm
×
17 mm) . . . . . . . . . 110
5.3. Full Package Outline Drawing (19 mm
× 19
mm) 129
5.4. Pin Assignments (19 mm
×
19 mm) . . . . . . . . . 130
Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 150
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
© Freescale Semiconductor, Inc., 2008-2012. All rights reserved.
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