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New energy storage and source-grid-load-storage integration have become an important task for Guangxi to build a new power system. In order to promote the construction of new energy storage and source...[Details]
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The Honor Smart Screen X1 series is equipped with the Honghu 818 smart chip. Regarding this chip, Xiong Junmin, Vice President of Honor Business Department (Product), told the story behind it. Xion...[Details]
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According to foreign media reports, fabless semiconductor supplier LX Semicon announced a collaboration with Microsoft to jointly develop 3D sensing solutions for applications in the Internet of Thin...[Details]
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On September 8, the first integrated photovoltaic storage and charging new charging station construction project in northern Guangdong was officially put into operation. The power station was launched...[Details]
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SRII launches two new ALD products to meet the needs of versatility and flexibility in pan-semiconductor applications
The atomic layer deposition (ALD) process is conside...[Details]
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Chapter 4 Oscilloscope Design—Main Interface Layout and Framework This chapter briefly explains the layout and framework of the main interface. 4.1 Main interface frame selection 4.2 Main interface l...[Details]
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I have been learning LabVIEW for a while and found that its functions are powerful and its programming is simple and efficient.
Now that the serial port communication has been preliminarily realized,...[Details]
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The purpose of embedded systems is to provide a complex digital system that is easy to develop with confidence in multi-tasking and networking. From the perspective of digital technology and inform...[Details]
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Autonomous driving is no longer popular, and recently another technology giant has stepped on the brakes! Just last week, it was suddenly reported that Alibaba Cloud Damo Academy had disbanded its ...[Details]
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3D printing
This word is being known and applied by more and more people, and the entire industry is bursting with vitality and thriving.
Looking at the development history of my country...[Details]
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Intel recently shared more details about the new interconnect UCIe at the On Industry Innovation Summit, which is the basis of the company's long-term plan for x86, Arm and RISC-V architectures to co...[Details]
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1. Instrument name Thermogravimetric Analyzer TGA 2. Picture display 3. Function Introduction Thermogravimetric analyzer TGA is an instrument that uses thermogravimetric method to detect the temp...[Details]
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KeilMDK STM32 uCOS-II compilation error: error: #268: declaration may not appear after executable statement in block Compile the file containing the following code /* * Function name: Task_USAR...[Details]
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As the cost of photovoltaic systems continues to decline, the country advocates the introduction of relevant photovoltaic policies such as distributed, household and poverty alleviation. The capital r...[Details]
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On September 30, 2024, ARM held a second quarter earnings conference call for fiscal year 2025. The company's CEO Rene Haas said: "During this year, we have exceeded all expectations in executing o...[Details]