PIC18F2510-I/ML datasheet, PDF

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PIC18F2510-I/ML: Description16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，376 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC18F2510-I/ML Overview

16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC28

PIC18F2510-I/ML Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFN
package instruction	6 X 6 MM, PLASTIC, QFN-28
Contacts	28
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	7 weeks
Samacsys Descripti	Microchip PIC18F2510-I/ML, 8bit PIC18F Microcontroller, 40MHz, 32 kB Flash, 28-Pin QFN
Has ADC	YES
Address bus width	20
bit size	16
CPU series	PIC
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQCC-N28
JESD-609 code	e3
length	6 mm
Humidity sensitivity level	1
Number of I/O lines	25
Number of terminals	28
On-chip program ROM width	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC28,.24SQ,25
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	1536
rom(word)	16384
ROM programmability	FLASH
Maximum seat height	1 mm
speed	40 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.2 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	NO LEAD
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

User Manual

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PIC18F2X1X/4X1X

28/40/44-Pin Flash Microcontrollers with

10-Bit A/D and nanoWatt Technology

Power-Managed Modes:

•

Run: CPU On, Peripherals On

Idle: CPU Off, Peripherals On

Sleep: CPU Off, Peripherals Off

Idle mode Currents Down to 3.0

μA

Typical

Sleep mode Currents Down to 20 nA Typical

Timer1 Oscillator: 1.8

μA,

32 kHz, 2V

Watchdog Timer: 2.1

μA

Two-Speed Oscillator Start-up

Flexible Oscillator Structure:

• Four Crystal modes, Up to 40 MHz

• 4x Phase Lock Loop (PLL) – Available for Crystal

and Internal Oscillators

• Two External RC modes, Up to 4 MHz

• Two External Clock modes, Up to 40 MHz

• Internal Oscillator Block:

- 8 user-selectable frequencies, from 31 kHz to

8 MHz

- Provides a complete range of clock speeds

from 31 kHz to 32 MHz when used with PLL

- User-tunable to compensate for frequency drift

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor:

- Allows for safe shutdown if peripheral clock stops

Peripheral Highlights:

• High-Current Sink/Source 25 mA/25 mA

• Up to 2 Capture/Compare/PWM (CCP) modules,

One with Auto-Shutdown (28-pin devices)

• Enhanced Capture/Compare/PWM (ECCP)

module (40/44-pin devices only):

- One, two or four PWM outputs

- Selectable polarity

- Programmable dead time

- Auto-shutdown and auto-restart

• Master Synchronous Serial Port (MSSP) module

Supporting 3-Wire SPI (all 4 modes) and I

C™

Master and Slave modes

• Enhanced Addressable USART module:

- Supports RS-485, RS-232 and LIN 1.2

- RS-232 operation using internal oscillator

block (no external crystal required)

- Auto-wake-up on Start bit

- Auto-Baud Detect

• 10-Bit, Up to 13-Channel Analog-to-Digital

Converter module (A/D):

- Auto-acquisition capability

- Conversion available during Sleep

• Dual Analog Comparators with Input Multiplexing

• Programmable 16-Level High/Low-Voltage

Detection (HLVD) module:

- Supports interrupt on High/Low-Voltage Detection

Special Microcontroller Features:

• C Compiler Optimized Architecture:

- Optional extended instruction set designed to

optimize re-entrant code

• 100,000 Erase/Write Cycle Flash Program

Memory Typical

• Three Programmable External Interrupts

• Four Input Change Interrupts

• Priority Levels for Interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT):

- Programmable period from 4 ms to 131s

• Single-Supply 5V In-Circuit Serial

Programming™ (ICSP™) via Two Pins

• In-Circuit Debug (ICD) via Two Pins

• Wide Operating Voltage Range: 2.0V to 5.5V

• Programmable Brown-out Reset (BOR) with

Software Enable Option

2009 Microchip Technology Inc.

DS39636D-page 3

PIC18F2X1X/4X1X

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 9

2.0 Oscillator Configurations ............................................................................................................................................................ 25

3.0 Power-Managed Modes ............................................................................................................................................................. 35

4.0 Reset .......................................................................................................................................................................................... 43

5.0 Memory Organization ................................................................................................................................................................. 55

6.0 Flash Program Memory.............................................................................................................................................................. 77

7.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 81

8.0 Interrupts .................................................................................................................................................................................... 83

9.0 I/O Ports ..................................................................................................................................................................................... 97

10.0 Timer0 Module ......................................................................................................................................................................... 115

11.0 Timer1 Module ......................................................................................................................................................................... 119

12.0 Timer2 Module ......................................................................................................................................................................... 125

13.0 Timer3 Module ......................................................................................................................................................................... 127

14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 131

15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 139

16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 153

17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 193

18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 213

19.0 Comparator Module.................................................................................................................................................................. 223

20.0 Comparator Voltage Reference Module................................................................................................................................... 229

21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 233

22.0 Special Features of the CPU.................................................................................................................................................... 239

23.0 Instruction Set Summary .......................................................................................................................................................... 259

24.0 Development Support............................................................................................................................................................... 309

25.0 Electrical Characteristics .......................................................................................................................................................... 313

26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 351

27.0 Packaging Information.............................................................................................................................................................. 353

Appendix A: Revision History............................................................................................................................................................. 361

Appendix B: Device Differences ........................................................................................................................................................ 361

Appendix C: Conversion Considerations ........................................................................................................................................... 362

Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 362

Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 363

Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 363

Index ................................................................................................................................................................................................. 365

The Microchip Web Site ..................................................................................................................................................................... 375

Customer Change Notification Service .............................................................................................................................................. 375

Customer Support .............................................................................................................................................................................. 375

Reader Response .............................................................................................................................................................................. 376

PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 377

2009 Microchip Technology Inc.

DS39636D-page 7

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