IC,SYNC SRAM,1KX1,CMOS,DIP,18PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1435297063 |
package instruction | DIP, DIP18,.3 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 180 ns |
JESD-30 code | R-XDIP-T18 |
JESD-609 code | e0 |
memory density | 1024 bit |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of terminals | 18 |
word count | 1024 words |
character code | 1000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 1KX1 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |