SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Rec. Press Fit
2.0mm Pitch
5 Row s
Mechanical
Contact Retention Force:
0.50Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
1A
Contact Resistance:
50m
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000M
min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING INF OR MATI ON
PRODUCT NO.: 1 F 2 2 * * * * - P * 0 1 0 * - * *
POS. NO.:
030=030 pos.
060=060 pos.
120=120 pos.
150=150 pos.
240=240 pos
Lead Free Code:
N=None
F=Lead Free
30
60
90
120
150
240
11.90
23.90
35.90
47.90
59.90
95.90
10.00
22.00
34.00
46.00
58.00
94.00
DIM. B
Package Type:
A=Tube
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
Extension Code:
N=Normal Plating
BODY STYLE
10=Standard Part
POS. DIM. A
Tail Length(DIM.T)
1=2.95mm
2=2.73mm
3=3.53mm
Tail Style:
P=Press Fit
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
Microcontroller MCU
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