LY61L12816AML-10I datasheet, PDF

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LY61L12816AML-10I: Description128K X 16 BIT HIGH SPEED CMOS SRAM; Categorystorage storage; File Size259KB，12 Pages; ManufacturerLyontek; Websitehttp://www.lyontek.com.tw/index.html; Environmental Compliance

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LY61L12816AML-10I Overview

128K X 16 BIT HIGH SPEED CMOS SRAM

LY61L12816AML-10I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Lyontek
package instruction	TSOP2,
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	10 ns
JESD-30 code	R-PDSO-G44
length	18.415 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	44
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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LY61L12816A

Rev. 1.1

128K X 16 BIT HIGH SPEED CMOS SRAM

REVISION HISTORY

Revision

Rev. 1.0

Rev. 1.1

Description

Initial Issue

Revise “TEST CONDITION” for VOH, VOL on page 3

= -8mA revised as -4mA

=4mA revised as 8mA

Issue Date

March. 07. 2013

June. 04. 2013

Lyontek Inc.

reserves the rights to change the specifications and products without notice.

5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.

TEL: 886-3-6668838

FAX: 886-3-6668836

LY61L12816AML-10I Related Products

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Description	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM	128K X 16 BIT HIGH SPEED CMOS SRAM
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	-	conform to
Maker	Lyontek	Lyontek	Lyontek	Lyontek	Lyontek	Lyontek	Lyontek	-	Lyontek
package instruction	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,	-	TSOP2,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	-	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	-	-	3A991.B.2.A
Maximum access time	10 ns	8 ns	10 ns	10 ns	8 ns	8 ns	10 ns	-	8 ns
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	-	R-PDSO-G44
length	18.415 mm	18.415 mm	18.415 mm	18.415 mm	18.415 mm	18.415 mm	18.415 mm	-	18.415 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	-	2097152 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM
memory width	16	16	16	16	16	16	16	-	16
Number of functions	1	1	1	1	1	1	1	-	1
Number of terminals	44	44	44	44	44	44	44	-	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	-	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	-	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	-	70 °C
organize	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	-	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	-	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage (Vsup)	2.7 V	3 V	2.7 V	2.7 V	3 V	3 V	2.7 V	-	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	-	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	-	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	-	10.16 mm

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