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LY61L12816AML-10

Description
128K X 16 BIT HIGH SPEED CMOS SRAM
Categorystorage    storage   
File Size259KB,12 Pages
ManufacturerLyontek
Websitehttp://www.lyontek.com.tw/index.html
Environmental Compliance
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LY61L12816AML-10 Overview

128K X 16 BIT HIGH SPEED CMOS SRAM

LY61L12816AML-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerLyontek
package instructionTSOP2,
Reach Compliance Codecompliant
Maximum access time10 ns
JESD-30 codeR-PDSO-G44
length18.415 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
®
LY61L12816A
Rev. 1.1
128K X 16 BIT HIGH SPEED CMOS SRAM
REVISION HISTORY
Revision
Rev. 1.0
Rev. 1.1
Description
Initial Issue
Revise “TEST CONDITION” for VOH, VOL on page 3
I
OH
= -8mA revised as -4mA
I
OL
=4mA revised as 8mA
Issue Date
March. 07. 2013
June. 04. 2013
Lyontek Inc.
reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
0

LY61L12816AML-10 Related Products

LY61L12816AML-10 LY61L12816AML-8 LY61L12816AML-10IT LY61L12816AML-10T LY61L12816AML-8I LY61L12816AML-8IT LY61L12816A_13 LY61L12816AML-8T LY61L12816AML-10I
Description 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM 128K X 16 BIT HIGH SPEED CMOS SRAM
Is it Rohs certified? conform to conform to conform to conform to conform to conform to - conform to conform to
Maker Lyontek Lyontek Lyontek Lyontek Lyontek Lyontek - Lyontek Lyontek
package instruction TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, - TSOP2, TSOP2,
Reach Compliance Code compliant compliant compliant compliant compliant compliant - compliant compliant
Maximum access time 10 ns 8 ns 10 ns 10 ns 8 ns 8 ns - 8 ns 10 ns
JESD-30 code R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 - R-PDSO-G44 R-PDSO-G44
length 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm 18.415 mm - 18.415 mm 18.415 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit - 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 - 16 16
Number of functions 1 1 1 1 1 1 - 1 1
Number of terminals 44 44 44 44 44 44 - 44 44
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words - 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 - 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C - 70 °C 85 °C
organize 128KX16 128KX16 128KX16 128KX16 128KX16 128KX16 - 128KX16 128KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 - TSOP2 TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm - 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 3 V 2.7 V 2.7 V 3 V 3 V - 3 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V
surface mount YES YES YES YES YES YES - YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS - CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL - COMMERCIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING - GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm - 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm - 10.16 mm 10.16 mm
ECCN code - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A

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