High Speed CMOS Triple 2-Channel Analog Multiplexer/Demultiplexer with TTL inputs 16-SOIC -55 to 125
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | GREEN, PLASTIC, SOIC-16 |
| Contacts | 16 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | High Speed CMOS Triple 2-Channel Analog Multiplexer/Demultiplexer with TTL inputs |
| Other features | ALSO OPERATES WITH 2V TO 10V (VCC-VEE) SUPPLY |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| Nominal bandwidth | 200 MHz |
| Maximum input voltage | 5.5 V |
| Minimum input voltage | |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e4 |
| length | 9.9 mm |
| Humidity sensitivity level | 1 |
| Maximum negative supply voltage (Vsup) | -6 V |
| Negative supply voltage minimum (Vsup) | |
| Nominal Negative Supply Voltage (Vsup) | -4.5 V |
| normal position | NC |
| Number of channels | 3 |
| Number of functions | 3 |
| Number of terminals | 16 |
| Nominal off-state isolation | 64 dB |
| On-state resistance matching specifications | 5 Ω |
| Maximum on-state resistance (Ron) | 130 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | COMMON OUTPUT |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP16,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5,GND/-5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.58 mm |
| Maximum signal current | 0.025 A |
| Maximum supply current (Isup) | |
| Maximum supply voltage (Vsup) | 5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 4.5 V |
| surface mount | YES |
| Maximum disconnect time | 31 ns |
| Maximum connection time | 34 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.91 mm |
PCB Design
Analogue and Mixed Signal
Microcontroller MCU
Automotive Electronics
Analog electronics
Microchip MCU
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