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MA000220801

Description
Material Content Data Sheet
File Size23KB,1 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
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MA000220801 Overview

Material Content Data Sheet

Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
TDK5110
MA000220801
PG-TSSOP-16-1
Material Group
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.497
8.109
11.199
0.447
0.108
4.586
31.417
0.915
0.856
0.124
0.438
Average
Mass
[%]
2.51
13.58
18.76
0.75
0.18
7.68
52.64
1.53
1.43
0.21
0.73
29. August 2013
59.70 mg
Sum
[%]
2.51
Average
Mass
[ppm]
25071
135846
32.34
0.75
187596
7480
1815
76825
60.50
1.53
1.43
526282
15325
14346
2071
0.94
7343
9414
1000000
604923
15325
14346
323442
7480
Sum
[ppm]
25071
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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