7MP4045S12Z datasheet, PDF - EEWORLD Datasheet

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7MP4045S12Z: DescriptionSRAM Module, 256KX32, 12ns, BICMOS, ZIP-64; Categorystorage storage; File Size489KB，8 Pages; ManufacturerIDT (Integrated Device Technology)

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7MP4045S12Z Overview

SRAM Module, 256KX32, 12ns, BICMOS, ZIP-64

7MP4045S12Z Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1164071021
package instruction	ZIP, ZIP64/68,.1,.1
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	12 ns
Other features	WD-MAX; IT ALSO HAVE CMOS TECHNOLOGY
I/O type	COMMON
JESD-30 code	R-XZMA-T64
JESD-609 code	e0
length	92.71 mm
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	64
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	ZIP
Encapsulate equivalent code	ZIP64/68,.1,.1
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	15.24 mm
Maximum standby current	0.32 A
Minimum standby current	4.5 V
Maximum slew rate	1.6 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	30
width	8.89 mm

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7MP4045S12Z Related Products

	7MP4045S12Z	IDT7MP4045S55Z	IDT7MP4045S45Z	IDT7MP4045S55M	7MP4045S45Z	7MP4045S17Z	7MP4045SA17Z	7MP4045SA25M
Description	SRAM Module, 256KX32, 12ns, BICMOS, ZIP-64	SRAM Module, 256KX32, 55ns, CMOS, PZIP64	SRAM Module, 256KX32, 45ns, CMOS, PZIP64	SRAM Module, 256KX32, 55ns, CMOS, PSMA64	BOARD-64, Box	SRAM Module, 256KX32, 17ns, BICMOS, ZIP-64	SRAM Module, 256KX32, 17ns, BICMOS, ZIP-64	SRAM Module, 256KX32, 25ns, CMOS, SIMM-64
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	unknown	not_compliant	unknown	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	12 ns	55 ns	45 ns	55 ns	45 ns	17 ns	17 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XZMA-T64	R-PZIP-T64	R-PZIP-T64	R-PSMA-N64	R-PZIP-T64	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32
Number of terminals	64	64	64	64	64	64	64	64
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	ZIP	ZIP	ZIP	SIMM	ZIP	ZIP	ZIP	SIMM
Encapsulate equivalent code	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	SSIM64	ZIP64/68,.1,.1	ZIP64/68,.1,.1	ZIP64/68,.1,.1	SSIM64
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	IN-LINE	IN-LINE	MICROELECTRONIC ASSEMBLY	IN-LINE	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	15.24 mm	16.002 mm	15.24 mm	16.002 mm	15.24 mm	15.24 mm	15.24 mm	16.002 mm
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	1.6 mA	0.96 mA	1.2 mA	0.96 mA	1.2 mA	1.6 mA	1.6 mA	1.36 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	BICMOS	CMOS	CMOS	CMOS	CMOS	BICMOS	BICMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	SINGLE	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	SINGLE
Is it lead-free?	Contains lead	-	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead
JESD-609 code	e0	e0	e0	-	e0	e0	e0	e0
Peak Reflow Temperature (Celsius)	225	-	225	-	NOT SPECIFIED	260	225	225
Maximum standby current	0.32 A	-	0.08 A	-	0.08 A	0.32 A	0.32 A	0.12 A
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	30	-	30	-	NOT SPECIFIED	6	30	30

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