Cross point mixer for telephones
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ROHM Semiconductor |
Parts packaging code | SOIC |
package instruction | SOP-24 |
Contacts | 24 |
Reach Compliance Code | compli |
JESD-30 code | R-PDSO-G24 |
JESD-609 code | e3/e2 |
length | 15 mm |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 75 °C |
Minimum operating temperature | -25 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.9 mm |
Nominal supply voltage | 5 V |
surface mount | YES |
Telecom integrated circuit types | CORDLESS TELEPHONE SUPPORT CIRCUIT |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | TIN/TIN COPPER |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 10 |
width | 5.4 mm |
BU8241F | BU8241FS | BU8242F | BU8244F | |
---|---|---|---|---|
Description | Cross point mixer for telephones | Cross point mixer for telephones | Cross point mixer for telephones | Cross point mixer for telephones |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to |
Maker | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
Parts packaging code | SOIC | SSOP | SOIC | SOIC |
package instruction | SOP-24 | SSOP-24 | SOP-20 | SOP-16 |
Contacts | 24 | 24 | 20 | 16 |
Reach Compliance Code | compli | compli | compli | compli |
JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G20 | R-PDSO-G16 |
JESD-609 code | e3/e2 | e3/e2 | e3/e2 | e3/e2 |
length | 15 mm | 10 mm | 12.5 mm | 10 mm |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 20 | 16 |
Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C |
Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SSOP | SOP | LSOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.9 mm | 1.9 mm | 1.9 mm | 1.6 mm |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES |
Telecom integrated circuit types | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT |
Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
Terminal surface | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 |
width | 5.4 mm | 5.4 mm | 5.4 mm | 4.4 mm |