plastic encapsulated package with a copper leadframe
substrate. This package uses perimeter lands on the
bottom of the package to provide electrical contact to the
PWB. The package also offers Amkor's ExposedPad
technology as a thermal enhancement. Having the die
attach paddle exposed on the bottom of the package
surface provides an efficient heat path when soldered
directly to the PWB. This enhancement also enables stable
ground by use of down bonds or by electrical connection
through a conductive die attach material.
Saw MLF PEL (Plated End Lead) Package
Customer demand for Fine lead pitch (0.50 mm, 0.65 mm) is needed in the
automotive Industry. Higher solder fillet height on the side of lead area;
similar or better BLR performance than standard design; no need of X-ray
monitoring after SMD. This process is released to HVM (High Volume
Manufacturing).
MLF Offerings
•
•
•
•
•
•
•
•
•
•
•
•
Chip-on-Lead (COL)
Single Row (Up to 108 I/O)
Dual Row (Up to 180 I/O)
Multi Chip Package
Non-Exposed Pad
PPF (NiPd) Punch & Saw MLF
Small MLF (Less than 2 x 2 body size)
Stacked Die
Thin
MicroLeadFrame
®
Top Exposed Pad (TEP)
Inframe Cavity MLF
Flipchip MLF
FAM (Film Assist Mold) MLF Package
Better release-ability which enables complicated mold structures like cavity-
open packages (Seal film); Protection on brittle surface of die and glass lids
from mechanical impact by cavity insert on mold chase (seal film); resin/mold
flash control (adhesive film).
PQFN (Power) MLF Package
To qualify FET (Field Effect Transistor) devices in QFN package using solder
paste and copper clip; layout and packaging use copper connections for all
power paths rather than wire bonds, reducing losses due to high resistance
wire bonds as well as high inductance which cause ringing and high AC
losses.
RtMLF (Routable Molded Lead Frame) Package
An MLF® package with resin filled traces for small form factor driven
structures. This offers a low cost, high thermal performance device in a
smaller foot print. It has internal routing traces with limited line width/space
capability and this package adapts easily to flipchip configurations. rtMLF
provides higher pin count and more flexible internal trace routing with resin
filled LF. It enable small form factor, high electrical/thermal performance with
low cost.
Dual Row MLF Package
An MLF package with two rows of leads offers a cost
effective, high performance solution for devices requiring
up to 180 I/O. Typical applications include hard disk drives,
USB controllers and wireless LAN.
Visit Amkor Technology online for locations and
to view the most current product information.
DS572Q
Rev Date: 10/15
Questions? Contact us: marketing@amkor.com
Data Sheet
MicroLeadFrame
®
MLF
®
/QFN/SON/DFN
Applications
The small size and weight along with excellent thermal and electrical
performance make the
MicroLeadFrame
package an ideal choice for
handheld portable applications such as cell phones and PDAs or any
other application where size, weight and package performance are
required.
LEADFRAME
Reliability Qualification
Amkor devices are assembled in optimized package designs with
proven reliable semiconductor materials.
• Moisture Sensitivity
JEDEC Level 1*, 85°C/85% RH, 168 hrs
Characterization
• uHAST
130°C/85% RH, 96 hrs
• Temp/Humidity
85°C/85% RH, 1000 hours
• Temp Cycle
-65°C/+150°C, 1000 cycles
• High Temp Storage
150°C, 1000 hours
*Depending on body size
Features
• Small size (reduce package footprint by 50% or more and improved
RF performance) and weight
• Standard leadframe process flow and equipment
• 0.4 mm to 2.03 mm maximum height
• 4 to 180 I/O
• 1-13 mm body size
• Thin profile and superior die-to-body size ratio
• Pb-free/Green
• Flexible designs for optimal electrical and thermal performance
• Saw and punch versions available
Process Highlights
• Die thickness
• Plating
• Marking
• Leadframe
• Die attach
• Wire
• Mold compound
.20 ± .05 mm nominal, thinner for special
applications
Matte Sn, NiPdAuAg
Laser
Copper alloy, dual gauge
Conductive epoxy, non-conductive epoxy
or DAF
0.8 mil Au, 1% PD doped, 0.8 mil Cu
0.8 mil Ag
Pb-free/Green capable
Standard Materials
Thermal Performance
Multi-layer PCB
Pkg
12 ld
28 ld
44 ld
52 ld
64 ld
124 ld
Body Size
(mm)
3x3
5x5
7x7
8x8
10 x 10
10 x 10
# Board
Vias
1
9
16
25
36
36
Exposed
Pad (mm)
1.25
2.7
4.8
6.1
7.1
7.1
Die
(mm)
1.25
2.54
3.81
5.08
2.79
2.79
ΘJA
(°C/W)
61.1
34.8
24.4
20.9
29.4
30.0
Test Services
•
•
•
•
•
Program generation/conversion
Product engineering
Available test/handling technology
Burn-in capabilities
Tape and reel services
JEDEC Standard Test Boards
Modeled data @ 0 air flow
Shipping
• Clear anti-static tubes, bakeable trays or metal canisters
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
0.564
0.531
1.766
1.194
2.179
1.475
0.203
0.220
0.326
0.289
0.518
0.409
141.8
138.9
315.1
234.5
337.5
250.8
Electrical Performance
Pkg
12 ld
44 ld
64 ld
Body Size
(mm)
3x3
7x7
10 x 10
Lead
Longest
Shortest
Longest
Shortest
Longest
Shortest
Simulated Results @ 2 GHz
Values dependent on specific die and wire configurations
Visit Amkor Technology online for locations and
to view the most current product information.
DS572Q
Rev Date: 10/15
Questions? Contact us: marketing@amkor.com
Data Sheet
MicroLeadFrame
®
MLF
®
/QFN/SON/DFN
Cross-sections MLF
Individual Unit Design "Punch"
Package Height Comparison
LEADFRAME
Map Design "Saw"
Configuration Options
MLF Package Family (mm)
Body Size (mm)
Saw
–
–
–
1x1
2x2
3x3
4x4
5x5
6x5
6x6
7x7
8x8
9x9
10 x 10
11 x 11
12 x 12
13 x 13
Punch
–
–
QFN/SON/DFN Lead Counts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm Pitch
4/ 6
6/8/10/12
4/8/10/12/16/20/24
12/16/20/24/28/32/40
16/20/28/32/36/40/44/52
18/24/36/42
20/24/28/36/40/48/56/64
28/32/36/44/48/56/68/80
32/36/40/52/56/68/76/88
36/44/48/60/64/76/88/104
44/52/56/68/72/88/100/116
–
48/60/84/88/100/108/124/144
–
Dual Row Lead Counts
0.5 mm Pitch
–
–
–
–
44/52
–
60/68
76/84
92/100
108/116
124/132
140/148
156/164
164/180
Save valuable board
space with MLF
®
packages!
Note:
Various package sizes available between (1 x 1) through (3 x 3), i.e., (2.5 x 2.5), (2 x 1), (1.5 x 1.5)
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
As a PCB design engineer with style, everyone must have known the layout and wiring rules of general PCB. However, are you also clear about the design rules of RF board PCB? Today, let's talk about t...
Internal functions: some special functions for the target CPU provided by the compiler, as well as commonly used functions that have been highly optimized through assembly.
The internal functions prov...
I got the msp432 board almost a year ago, and just started the LED lighting project:First of all, the clock module (CS) of msp432. Personally, I think the most distinctive feature of msp432 should be ...
Can INA282 sample AC voltage? I want to use it to sample AC, the frequency ranges from 100hz to 10khz, but the actual measurement is not 50 times magnification...
Assume that data is read from 8-bit AD (if it is a higher-bit AD, the data type can be defined as int), the subroutine is get_ad();
1. Limit filter/* The A value can be adjusted according to the actua...
Following the advent of steam engines, large-scale industrial production and industrial automation, with the gradual formation of the Internet of Things and intelligent manufacturing, the "Industry 4...[Details]
降低电池成本，是电动车进行大规模普及、售价逼近燃油车甚至更低所面临的最大难题。一向以成本杀手著称的伊隆·马斯克深谙此道，特斯拉从弱小走向无敌的进程就是马斯克对极致成本的追求。按照马斯克在今年电池日的说法，特斯拉从第一性原理出发，致力于降低电芯设计、电芯制造、阳极材料、阴极材料、电芯集成等全电池价值链成本，最终要在2023年将电池组的成本降低56%至60美元/千瓦时。 Based on thi...[Details]
ZTE, endorsed by Wu Jing, has launched a new mobile phone. The most amazing thing about this phone is that it uses an under-screen camera, and through special technology and algorithms, the imaging e...[Details]
If we say, the Model T embodies Henry Ford's lifelong goal - to make cars accessible to ordinary people. So now, millimeter wave radar manufacturers will also achieve their goals in the field of smar...[Details]
1. Introduction
With the increase of electronic systems in automobiles, how to efficiently test highly mechatronic automobile systems has become a challenge faced by Chinese test engineers...[Details]
The evolution of automobile intelligence has given rise to a golden track for automotive-grade chips. Currently, the automotive chip field is dominated by internationally renowned manufacturers such ...[Details]
More and more details are emerging about LG's upcoming new form factor phone, the LG Rollable, which features a unfoldable screen. Many details of the device have appeared on a Korean forum, invo...[Details]
The effects on February 21, 2022 are as follows Transplant lvgl on w801 and add APP simulation Chinese support The whole world is learning Chinese Confucius' words are becoming more international...[Details]
introduction Batteries power many different applications across a wide range of industries. In many of these applications, using a charging connector is difficult or impossible. For example, some pr...[Details]
System designers are often asked to reduce overall power consumption to reduce the impact on our environment while reducing capital and operating costs. They are also required to increase circuit d...[Details]
This is the schematic diagram. From the rightmost side of the diagram, there is a resistor array, which means eight resistors are packaged together. The characteristic of the resistor array here ...[Details]
1. Review of RTC real-time clock knowledge 1. Working principle block diagram The RTC_CNT register will add 1 every clock cycle under the control of TR_CLK. For example, in 1970, we set RTC_CNT to...[Details]
The launching ceremony of the "Xinchuang Cup - The First College Future Automotive Human-Computer Interaction Design Competition" was successfully held in Beijing, hosted by the Automotive Electronic...[Details]
Circuit introduction: 1. This project uses 51 single-chip microcomputer to realize the function of music box, and the circuit uses analog oscilloscope to view the waveform changes in real time. 2. ...[Details]
The content of this article mainly focuses on the connotation, function, scale, perspective and data source of autonomous driving vehicle testing scenarios.
01. Scenario elements and sce...[Details]
PCB Design
京公网安备 11010802033920号
EEWORLD
