SMJ2708-35JM datasheet, PDF - EEWORLD Datasheet

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SMJ2708-35JM: DescriptionIC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC; Categorystorage storage; File Size471KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SMJ2708-35JM Overview

IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC

SMJ2708-35JM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1435456049
package instruction	DIP, DIP24,.6
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	350 ns
JESD-30 code	R-XDIP-T24
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	1024 words
character code	1000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
technology	MOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SMJ2708-35JM Related Products

	SMJ2708-35JM	TMS2708JL	TMS2708-45JDL	TMS2708-35JDL	TMS27L08-45JDL	TMS27L08JL	SMJ2708-45JM	SMJ27L08-45JM
Description	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	350 ns	450 ns	450 ns	350 ns	450 ns	450 ns	450 ns	450 ns
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
memory width	8	8	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24	24	24
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Memory IC Type	OTP ROM	OTP ROM	-	-	-	OTP ROM	OTP ROM	OTP ROM
Base Number Matches	-	1	1	1	1	1	-	-

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