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TMS27L08JL

Description
IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size471KB,9 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

TMS27L08JL Overview

IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC

TMS27L08JL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.6
Reach Compliance Codenot_compliant
Maximum access time450 ns
JESD-30 codeR-XDIP-T24
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

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Description IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
Maximum access time 450 ns 450 ns 450 ns 350 ns 450 ns 350 ns 450 ns 450 ns
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24
memory density 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit
memory width 8 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000 1000 1000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C 125 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO NO
technology MOS MOS MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Memory IC Type OTP ROM OTP ROM - - - OTP ROM OTP ROM OTP ROM
Base Number Matches 1 1 1 1 1 - - -
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