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The plastic package forms and pin arrangement of some boost DC/DC converters are shown in the figure, and their main characteristic parameters are shown in the table Some boost DC/DC conve...[Details]

The packaging form of MEMS devices is a key factor in bringing MEMS-based system solutions to the market. Research has found that in typical MEMS-based products today, packaging costs account for a...[Details]

#include hidef.h       /* common defines and macros */ #include mc9s12dg128.h      /* derivative information */ #pragma LINK_INFO DERIVATIVE "mc9s12dg128b" unsigned int i; void main(void)  {  DDRB=...[Details]

Some time ago, I recommended MIFANS Pi T527 to you. It is a high-performance T527 development board launched by Mir Electronics. Today I would like to recommend to you the brother of M...[Details]

In order to support audio customers' product iteration and chip selection and speed up product development, Xinfei Electronics has designed a digital audio processing solution with modular amplifie...[Details]

The default execution order of the microprocessor for instructions taken from consecutive memory address units is linear, that is, sequential execution of instructions. However, in actual applications...[Details]

0 Introduction Liquid crystal display (LCD) is a light modulating device that does not emit light by itself. Therefore, in order to clearly see the display content of the transmissive LCD,...[Details]

Recently, according to foreign media reports, SK On, the battery business unit of SK Innovation, is considering developing lithium iron phosphate batteries. Previously, the company mainly manufacture...[Details]

I would like to briefly talk about the software and hardware collaborative processing flow after an exception occurs at the user level of the ARM platform. This is a general overview. After understan...[Details]

According to media reports, Wang Jun, president of Changan Automobile Co., Ltd., said that the first high-end smart electric vehicle under the CHN architecture jointly built by Changan Automobile, Hu...[Details]

The Power Distribution Unit (PDU) in the telecommunications closet provides power to up to six tower mounted amplifiers (TMAs) through RF feeds and bias devices. The PDU performs voltage regulation...[Details]

On April 20, Reuters reported that according to an investment term sheet, Taiwan chip foundry TSMC has raised US$3.5 billion in bonds for its new wafer factory in Arizona, USA. TSMC, a major suppli...[Details]

    Electronic fence is the most advanced, best-performing, safest and most secure perimeter security product in the world. Electronic fence originated in Australia. Since its introduction, it has bee...[Details]

A few days ago, I received a call from a customer's engineer. She seemed a little nervous on the phone. She told me that they had a serious problem when using our HDMI Cable test and verification syst...[Details]

Basic Overview of Automotive Chips Automotive-grade semiconductors, also known as "automotive chips," are used in areas such as vehicle control devices, vehicle-mounted monitoring devices, and...[Details]