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HPC0402CR80BX1T0

Description
CAPACITOR, CERAMIC, 6V, 0.0000008uF, SURFACE MOUNT, 0402, CHIP
CategoryPassive components    capacitor   
File Size129KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

HPC0402CR80BX1T0 Overview

CAPACITOR, CERAMIC, 6V, 0.0000008uF, SURFACE MOUNT, 0402, CHIP

HPC0402CR80BX1T0 Parametric

Parameter NameAttribute value
Objectid1980834807
package instruction, 0402
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance8e-7 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee0
Installation featuresSURFACE MOUNT
multi-layerNo
negative tolerance12.5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR
positive tolerance12.5%
Rated (DC) voltage (URdc)6 V
size code0402
surface mountYES
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceTIN LEAD
Terminal shapeONE SURFACE
Not for new designs, this product will be discontinued soon
HPC0402B/C
Vishay
High Performance, High Precision Wire-Bondable 0402 Capacitor
for Smartcard, High-Frequency and
Substrate-Embedded Applications
FEATURES
Terminations are RoHS compliant in Au
(JEDEC “e4”). Sn/Ag/Cu (JEDEC “e1”) & Sn/Pb
available
New technology monolithic-silicon capacitor
based on a special semiconductor process
Construction reduces the parasitic inductance
and brings the SRF values to ultra-high frequencies
Capacitance is extremely stable in a wide range of
frequencies from 1 MHz to several GHz
High Q and low ESR
Tight tolerance to ± 1 % or 0.05 pF
Ultra high SRF
Low parasitic inductance (~ 0.032 nH)
Capacitance range: 0.1 pF to 180
Low profile - 0.18 mm (0.007 inches)
Wire-bondable (Type B) or SMD (Type C)
PATENTED
ELECTRICAL SPECIFICATIONS
Operating Temperature:
- 55 °C to + 125 °C
Temperature Coefficient
of Capacitance (TCC):
0 ± 30 ppm/°C
Insulation Resistance:
10
11
Ω
min
Voltage:
2.5 x rated voltage (DC)
for 5 seconds
Ageing:
none
APPLICATIONS
Contactless Smart Cards
Embedded substrates
High-frequency/high data-rate circuits
ENVIRONMENTAL SPECIFICATIONS
Life Test:
Thermal Shock:
Moisture Resistance:
1000 hours, + 125 °C at
2 x rated voltage (DC)
100 Cycles, - 55 °C/+ 150 °C
1000 hours at rated DCV,
85 % RH, + 85 °C
CAPACITANCE TOLERANCE CODE
FOR LESS THAN 10 pF
A
B
C
FOR 10 pF AND HIGHER
F
±1%
G
±2%
J
±5%
± 0.05 pF ± 0.10 pF ± 0.25 pF
ORDERING INFORMATION
HPC
MODEL
0402
SIZE
B
TYPE
B or C
B = WB
C = SMD
101
CAPACITANCE VALUE
The first two digits are
significant, the third is a
multiplier. An “R”
indicates a decimal point.
Examples: 101 = 100 pF
Expressed in pF
G
CAPACITANCE
TOLERANCE
see chart above
G
TERMINATION
G = Gold bonding
termination
(B type)
W = Lead
(Pb)-free
X = Tin/Lead
termination
(C type)
X
VOLTAGE
1=6V
Z = 10 V
Y = 16 V
X = 25 V
M = 50 V
L = 100 V
T0
PACKAGING
T0 = 10 000 pcs
T5 = 5000 pcs
T1 = 1000 pcs
tape and reel
W = 20 000 pcs
on dicing frame
(available on
B type only)
For “C” Type, “W” terminations preferred over “X”.
“See Part Numbering System, Document 10147, for complete explanations.”
* Pb containing terminations are not RoHS compliant, exemptions may apply.
www.vishay.com
16
For technical questions, contact: siliconRFcap@vishay.com
Document Number: 10120
Revision: 16-Dec-08
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