FIFO, 4KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1489884876 |
package instruction | 0.300 INCH, PLASTIC, DIP-28 |
Reach Compliance Code | unknown |
Maximum access time | 65 ns |
Maximum clock frequency (fCLK) | 12.5 MHz |
period time | 80 ns |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
memory density | 36864 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 4096 words |
character code | 4000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX9 |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.065 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |