VSM0805
Vishay Foil Resistors
SURFACE MOUNT
Bulk Metal
®
Foil Technology
Discrete Surface Mount Chip Resistors
FEATURES
•
Nominal TCR: + 0.6ppm/°C (0 to 25°C)
- 0.6ppm/C° (+ 25°C to + 60°C)
+ 2.2ppm/°C (- 55°C to + 25°C)
- 1.8ppm/°C (+ 25°C to + 125°C)
• Absolute Tolerance: to
±
0.01%
• Resistance Range: 5.5Ω to 12K
• Load Life Stability:
±
0.025% (2000 hours @ 70°C)
• Shelf Life Stability: 0.005% Maximum
∆R
• Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)
•
Current Noise: < - 40dB
•
Non Inductive: < 0.08µH
• Terminal Finishes Available:
Lead (Pb)-free (Sn 99.3% Cu 0.7%)
Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%)
Product may not
be to scale
The VSM0805 represents the latest addition and smallest size
to the Precision Bulk Metal
®
Foil (BMF) technology surface
mount chip resistor series. The VSM0805 has a conventional
full wrap around termination.
The BMF technology offers designers the lowest and most
predictable absolute Temperature Coefficient Resistance
available. The TCR is a process capability not a selection
process and for the most part is independent of ohmic value
and lot related variations.
The availability of tight absolute tolerance provides a good cost
solution for the variability of other components when compiling
the total error budget. BMF offers the best stability available;
and is an order of magnitude better than thin film technology.
The noise generated by the resistor is non measurable and its
design and construction make it well suited for high frequency
applications. The BMF is the ultimate resistor component for
analog applications.
TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE
VALUE
(
Ω
)
250Ω to 12K
100Ω to < 250
50Ω to < 100
25Ω to < 50
10Ω to < 25
5.5Ω to <10
TIGHTEST
TOLERANCE (%)*
±
0.01
±
0.02
±
0.05
±
0.1
±
0.25
±
0.5
FIGURE 1 - NOMINAL TCR CURVE
–55
–50
+500
+400
+300
+200
+100
–25
0
+25
+50
+75
+100
+125
*Tighter tolerances are available. Please contact Application
Engineering. Soldering temperatures used during installation may
cause resistance to shift up to 0.05%.
-5
+5
pp
m
pp
m
Nominal Resistance/
Temperature (RT) Curve
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
TEST
MIL-PRF-55342G
CHARACTERISTIC. E
∆
R LIMITS
±
0.10%
±
0.10%
±
0.10%
±
0.10%
±
0.20%
±
0.20%
±
0.50%
VSM
MAXIMUM
∆
R LIMITS*
±
0.02%
±
0.02%
±
0.02%
±
0.05%
±
0.05%
±
0.10%
±
0.025%
∆R
R
(ppm)
0
–100
–200
–300
–400
–500
Maximum
Spread
±2.3
ppm/°C
+2.2 ppm/°C
Nominal Chord
Slope (TCR)
–1.8 ppm/°C
Nominal Chord
Slope (TCR)
Standard
Spread
±2.0
ppm/°C
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
–55°C / +25°C / +125°C are the test points
with +25°C as the reference temperature
The TCR for values < 100Ω are influenced by the termination
composition and result in a deviation from this curve. Contact our
application engineering department for detailed specification on low
values
Moisture Resistance
Life 2000 hours @ + 70
°
C
*As shown + 0.01 Ohms to allow for measurement errors at low values.
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
www.vishay.com
22
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63061
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 17-Aug-04
VSM0805
Bulk Metal
®
Foil Technology
Discrete Surface Mount Chip Resistors
FIGURE 2 - POWER DERATING CURVE
Percent of Rated Power
125
100
Vishay Foil Resistors
SURFACE MOUNT
FIGURE 3 - RECOMMENDED MOUNTING
–55°C
+70°C
Rated Power
25% to 85% of T
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
TABLE 3 - CHIP SIZES AND SPECIFICATIONS
in inches (millimeters)
Top View
L
Bottom View
L
Recommended Land Pattern
X
T
W
T
D
W
Footprint
G
Z
CHIP
SIZE
L
W
T
D
POWER MAXIMUM RESISTANCE MAXIMUM
+ 70
°
C VOLTAGE
(mW)
50
(V)
22
RANGE
(
Ω
)
5.5 - 12K
WEIGHT
(mG)
6
Z*
G*
X*
±
0.005 (0.13)
±
0.005 (0.13) MAXIMUM
±
0.005 (0.13)
0805 0.080 (2.03)
0.050 (1.27) 0.025 (0.64) 0.015 (0.38)
±
0.004 (0.10)
±
0.004 (0.10)
±
0.004 (0.10)
0.122 (3.10)
0.028 (0.70)
0.050 (1.27)
*Land Pattern Dimensions (Z, G, X) are per IPC-782A
TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS
MODEL
VSM
CHIP SIZE
0805
RESISTANCE VALUE
RESISTANCE
RANGE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
x 1.0
x 10
3
TOLERANCE
T
±
0.01%
Q
±
0.02%
A
±
0.05%
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
TERMINATION
S
- Lead (Pb)-free
B
- Tin/Lead
PACKAGING
T = Tape and
Reel
W = Waffle
PacK
5Ω to <1KΩ
R
Example: 249R00 = 249Ω
1K to 12KΩ
K
Example: 10K000 = 10.0KΩ
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63061
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 17-Aug-04
www.vishay.com
23
Electronics Design Contest
京公网安备 11010802033920号
EEWORLD
