|
SN74HC125DTE4 |
SN74HC125DBRE4 |
SN74HC125DBRG4 |
SN74HC125DTG4 |
SN74HC125PWTE4 |
Description |
Buffers & Line Drivers Quad Bus Buff Gate With 3-State Outputs |
Buffers & Line Drivers Quad Bus Buff Gate With 3-State Outputs |
Buffers & Line Drivers QUADBusBuffer Gates |
Buffers & Line Drivers QUADBusBuffer Gates |
Buffers & Line Drivers Quad Bus Buff Gate With 3-State Outputs |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
SSOP |
SSOP |
SOIC |
TSSOP |
package instruction |
SOP, SOP14,.25 |
SSOP, SSOP14,.3 |
SSOP, SSOP14,.3 |
SOP, SOP14,.25 |
TSSOP, TSSOP14,.25 |
Contacts |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
unknow |
Control type |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
series |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
8.65 mm |
6.2 mm |
6.2 mm |
8.65 mm |
5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
MaximumI(ol) |
0.006 A |
0.006 A |
0.006 A |
0.006 A |
0.006 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
Number of digits |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
Number of ports |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SSOP |
SSOP |
SOP |
TSSOP |
Encapsulate equivalent code |
SOP14,.25 |
SSOP14,.3 |
SSOP14,.3 |
SOP14,.25 |
TSSOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
Prop。Delay @ Nom-Su |
30 ns |
30 ns |
30 ns |
30 ns |
30 ns |
propagation delay (tpd) |
190 ns |
190 ns |
190 ns |
190 ns |
190 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
2 mm |
2 mm |
1.75 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
0.65 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3.9 mm |
5.3 mm |
5.3 mm |
3.9 mm |
4.4 mm |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
Base Number Matches |
1 |
- |
- |
1 |
1 |