Microwire BUS 2Kbit(128 x 16bit) EEPROM
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ROHM Semiconductor |
Parts packaging code | SOIC |
package instruction | SSOP-8 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 2 MHz |
Data retention time - minimum | 40 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e2 |
length | 4.4 mm |
memory density | 2048 bi |
Memory IC Type | EEPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 128 words |
character code | 128 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128X16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SSOP |
Encapsulate equivalent code | TSSOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2/5 V |
Certification status | Not Qualified |
Maximum seat height | 1.25 mm |
Serial bus type | MICROWIRE |
Maximum standby current | 0.000002 A |
Maximum slew rate | 0.0045 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Copper (Sn/Cu) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 10 |
width | 3 mm |
Maximum write cycle time (tWC) | 5 ms |
write protect | SOFTWARE |
BR93L56RFV-W | BR93L56F-W | BR93L56FJ-W | BR93L56RF-W | BR93L56FV-W | BR93L56FVT-W | BR93L56RFVM-W | BR93L56RFVT-W | BR93L56RFJ-W | BR93L56RFVJ-W | |
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Description | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM | Microwire BUS 2Kbit(128 x 16bit) EEPROM |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | MSOP | SOIC | SOIC | SOIC |
package instruction | SSOP-8 | SOP-8 | SOP-8 | SOP-8 | SSOP-8 | TSSOP-8 | MSOP-8 | TSSOP-8 | SOP-8 | TSSOP-8 |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum clock frequency (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
Data retention time - minimum | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
JESD-609 code | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 |
length | 4.4 mm | 5 mm | 4.9 mm | 5 mm | 4.4 mm | 4.4 mm | 2.9 mm | 4.4 mm | 4.9 mm | 3 mm |
memory density | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
character code | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 | 128X16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SSOP | SOP | SOP | SOP | SSOP | TSSOP | VSSOP | TSSOP | SOP | TSSOP |
Encapsulate equivalent code | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.16 | TSSOP8,.25 | SOP8,.25 | TSSOP8,.19 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
power supply | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.25 mm | 1.71 mm | 1.65 mm | 1.6 mm | 1.25 mm | 1.2 mm | 0.9 mm | 1.2 mm | 1.65 mm | 1.1 mm |
Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
Maximum standby current | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
Maximum slew rate | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn97.5Cu2.5) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
width | 3 mm | 4.4 mm | 3.9 mm | 4.4 mm | 3 mm | 3 mm | 2.8 mm | 3 mm | 3.9 mm | 3 mm |
Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |