DATACOM, PCM TRANSCEIVER, BGA49
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | DALLAS |
package instruction | CABGA-49 |
Reach Compliance Code | unknow |
JESD-30 code | S-XBGA-B49 |
JESD-609 code | e0 |
Number of functions | 1 |
Number of terminals | 49 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA49,7X7,32 |
Package shape | SQUARE |
Package form | GRID ARRAY |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 0.125 mA |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | PCM TRANSCEIVER |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
DS2148GN | DS2148 | DS2148G | DS2148T | DS2148TN | DS21Q48 | DS21Q48N | |
---|---|---|---|---|---|---|---|
Description | DATACOM, PCM TRANSCEIVER, BGA49 | 5V E1/T1/J1 Line Interface | DATACOM, PCM TRANSCEIVER, BGA49 | DATACOM, PCM TRANSCEIVER, PQFP44 | DATACOM, PCM TRANSCEIVER, PQFP44 | DATACOM, PCM TRANSCEIVER, PBGA144 | DATACOM, PCM TRANSCEIVER, PBGA144 |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | DALLAS | - | DALLAS | DALLAS | DALLAS | DALLAS | DALLAS |
package instruction | CABGA-49 | - | CABGA-49 | TQFP-44 | TQFP-44 | BGA-144 | BGA-144 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow |
JESD-30 code | S-XBGA-B49 | - | S-XBGA-B49 | S-PQFP-G44 | S-PQFP-G44 | S-PBGA-B144 | S-PBGA-B144 |
JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 49 | - | 49 | 44 | 44 | 144 | 144 |
Maximum operating temperature | 85 °C | - | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
Package body material | UNSPECIFIED | - | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | - | FBGA | QFP | QFP | BGA | BGA |
Encapsulate equivalent code | BGA49,7X7,32 | - | BGA49,7X7,32 | TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | BGA144,12X12,50 | BGA144,12X12,50 |
Package shape | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | - | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY |
power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 0.125 mA | - | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA |
Nominal supply voltage | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | - | YES | YES | YES | YES | YES |
technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
Telecom integrated circuit types | PCM TRANSCEIVER | - | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER |
Temperature level | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | - | BALL | GULL WING | GULL WING | BALL | BALL |
Terminal pitch | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | - | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM |