IC Design Terminology

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IC Design Terminology

Abrupt junction Accelerated testing Acceptor Acceptor atom Accumulation Accumulating contact Accumulation region Accumulation layer Active region Active component Active device Activation Activation energy Active region Admittance Allowed band Alloy-junction device Aluminum (Aluminium) Aluminum – oxide Aluminum passivation Ambipolar Ambient temperature Amorphous Amplifier Analogue (Analog) comparator Angstrom Anneal Anisotropic Anode Arsenic (AS) Auger Auger process Auger processAvalanche Avalanche breakdown Avalanche excitation Background carrier Background doping Backward Backward bias Ballasting resistor Ball bond Band Band gap Barrier Barrier layer Barrier width Base Base contact Base stretching Base transit time Base transport efficiency Base -width modulation Basis vector Bias Bilateral switch Binary code Binary compound semiconductor Bipolar Bipolar Junction Transistor (BJT) Bloch Blocking band Blocking contact Body - centered Body-centred cubic structure Body-centered structureBoltzmann Bond Bonding electron Bonding pad Bootstrap circuit Bootstrapped emitter follower Boron Borosilicate glass Boundary condition Bound electron Breadboard Break down Break over Brillouin Brillouin zone Built-in Build-in electric field Bulk Bulk absorption Bulk generation Bulk recombination Burn - in Burn out Buried channel Buried diffusion region Can Capacitance Capture cross section Capture carrier Carrier Carry bit Carry -in bit Carry-out bit Cascade Case Cathode Center Ceramic Channel Channel breakdown Channel current Channel doping Channel shortening Channel width Characteristic impedance Charge Charge-compensation effects Charge conservation Charge neutrality condition Charge drive/exchange/sharing/transfer/storage Chemmical etching 化学腐蚀法 Chemically-Polish 化学抛光 Chemmically-Mechanically Polish (CMP) 化学机械抛光 Chip 芯片 Chip yield 芯片成品率 Clamped 箝位 Clamping diode 箝位二极管 Cleavage plane 解理面 Clock rate 时钟频率 Clock generator 时钟发生器 Clock flip-flop 时钟触发器 Close-packed structure 密堆积结构 Close-loop gain 闭环增益 Collector 集电极 Collision 碰撞 Compensated OP-AMP 补偿运放 Common-base/collector/emitter connection 共基极 / 集电极 / 发射极连接 Common-gate/drain/source connection 共栅 / 漏 / 源连接 Common-mode gain 共模增益 Common-mode input 共模输入 Common-mode rejection ratio (CMRR) 共模抑制比 Compatibility 兼容性 Compensation 补偿 Compensated impurities 补偿杂质 Compensated semiconductor 补偿半导体 Complementary Darlington circuit 互补达林顿电路 Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) 互补金属氧化物半导体场效应晶体管 Complementary error function 余误差函数 Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计 / 测试 / 制造 Compound Semiconductor 化合物半导体 Conductance 电导 Conduction band (edge) 导带 ( 底 ) Conduction level/state 导带态 Conductor 导体 Conductivity 电导率 Configuration 组态 Conlomb 库仑 Conpled Configuration Devices 结构组态 Constants 物理常数 Constant energy surface 等能面 Constant-source diffusion 恒定源扩散 Contact 接触 Contamination 治污 Continuity equation 连续性方程 Contact hole 接触孔 Contact potential 接触电势 Continuity condition 连续性条件 Contra doping 反掺杂 Controlled 受控的 Converter 转换器 Conveyer 传输器 Copper interconnection system 铜互连系统 Couping 耦合 Covalent 共阶的 Crossover 跨交 Critical 临界的 Crossunder 穿交 Crucible 坩埚 Crystal defect/face/orientation/lattice 晶体缺陷 / 晶面 / 晶向 / 晶格 Current density 电流密度 Curvature 曲率 Cut off 截止 Current drift/dirve/sharing 电流漂移 / 驱动 / 共享 Current Sense 电流取样 Curvature 弯曲 Custom integrated circuit 定制集成电路 Cylindrical 柱面的 Czochralshicrystal 直立单晶 Czochralski technique 切克劳斯基技术（ Cz 法直拉晶体 J ） Dangling bonds 悬挂键 Dark current 暗电流 Dead time 空载时间 Debye length 德拜长度 De.broglie 德布洛意 Decderate 减速 Decibel (dB) 分贝 Decode 译码 Deep acceptor level 深受主能级 Deep donor level 深施主能级 Deep impurity level 深度杂质能级 Deep trap 深陷阱 Defeat 缺陷 Degenerate semiconductor 简并半导体 Degeneracy 简并度 Degradation 退化 Degree Celsius(centigrade) /Kelvin 摄氏 / 开氏温度 Delay 延迟 Density 密度 Density of states 态密度 Depletion 耗尽 Depletion approximation 耗尽近似 Depletion contact 耗尽接触 Depletion depth 耗尽深度 Depletion effect 耗尽效应 Depletion layer 耗尽层 Depletion MOS 耗尽 MOS Depletion region 耗尽区 Deposited film 淀积薄膜 Deposition process Design rules Die Diode Dielectric Dielectric isolation Difference-mode input Differential amplifier Differential capacitance Diffused junction Diffusion coefficient Diffusion constant Diffusivity Diffusion capacitance/barrier/current/furnace Digital circuit Dipole domain Dipole layer Direct-coupling Direct-gap semiconductor Direct transition Discharge Discrete component Dissipation Distribution Distributed capacitance Distributed model Displacement Dislocation Domain Donor Donor exhaustion Dopant Doped semiconductor Doped semiconductorDoping concentration Double-diffusive MOS(DMOS) Drift Drift field Drift mobility Dry etching Dry/wet oxidation Dose Duty cycle Dual-in-line package （ DIP ） Dynamics Dynamic characteristics Dynamic impedance Dynamic impedance Early effect Early failure Early failure Effective mass Einstein relation(ship) Electric Erase Programmable Read Only Memory(E2PROM) Electrode Electrominggratim Electron affinity Electron -grade Electron-beam photo-resist exposure Electron gas Electron-grade water Electronic grade pure waterElectron trapping centerElectron Volt (eV) Electrostatic ElementElemental semiconductorEllipseEllipsoidEmitterEmitter - coupled logicEmitter-coupled pairEmitter followerEmpty bandEmitter crowding effectEndurance test =life testEnergy stateEnergy momentum diagramEnhancement modeEnhancement MOSEnteficEnvironmental testEpitaxialEpitaxial layerEpitaxial sliceExpitaxyEquivalent curcuitEquilibrium majority / minority carriers Balanced majority / minority carriers Erasable Programmable ROM (EPROM) Error function complement Etch Etchant Etching mask Excess carrier Excitation energy Excited state Exciton Extrapolation Extrinsic Extrinsic semiconductor Face - centered Fall time Fan-in Fan-out Fast recovery Fast surface states Feedback Fermi level Fermi-Dirac Distribution Femi potential Fick equation Field effect transistor Field oxide Filled band Film Flash memory Flat band Flat pack Flicker noise Flip-flop toggle Floating gate Fluoride etch Forbidden band Forward bias Forward blocking /conducting Frequency deviation noise Frequency response Function Gain Gallium-Arsenide(GaAs) Gamy ray Gate Gate oxide Gauss ( ian ) Gaussian distribution profile Gaussian doping distributionGeneration-recombination Geometries Germanium(Ge) Graded Graded (gradual) channel Graded junction Grain Gradient Grown junction Guard ring Gummel-Poom model Gunn-effect Hardened device Heat of formation Heat sink Heavy/light hole band Heavy saturation Hell-effect Heterojunction Heterojunction structure Heterojunction Bipolar Transistor (HBT) High field property High-performance MOS.(H-MOS) Hormalized Horizontal epitaxial reactor Hot carrier Hybrid integration Image - force Impact ionization Impedance Imperfect structure Implantation dose Implanted ion Impurity Impurity scattering Incremental resistance In-contact mask Indium tin oxide (ITO) Induced channel Infrared Injection Input offset voltage Insulator Insulated Gate FET(IGFET) Integrated injection logic Integration Interconnection Interconnection time delay Interdigitated structure Interface Interference International system of unions Internally scattering Interpolation Intrinsic semiconductor Inverse operation Inversion Inverter Ion Ion beam Ion etching Ion implantation Ionization Ionization energy Irradiation Isolation land Isotropic Junction FET(JFET) Junction isolation Junction spacing Junction side-wall Latch up Lateral Lattice Layout Lattice binding/cell/constant/defect/distortion Leakage current Level shifting Life time Linearity Linked bond Liquid Nitrogen Liquid - phase epitaxial growth technique Lithography Light Emitting Diode (LED) Load line or Variable Locating and Wiring Longitudinal Logic swing Lorentz Lumped model Majority carrier Mask Mask level Mask set Mass - action law Master-slave D flip-flop Matching Maxwell Mean free path Meandered emitter junction Mean time before failure (MTBF) Megeto - resistance Mesa MESFET-Metal Semiconductor Metallization Microelectronic technique Microelectronics Millen indices Minority carrier Misfit Mismatching Mobile ions Mobility Module Modulate Molecular crystal Monolithic IC MOSFET Mos. Transistor (MOST) Multiplication Modulator Multi-chip IC Multi -chip module (MCM) Multiplication coefficient Naked chip Negative feedback Negative resistance Nesting Negative-temperature-coefficient Noise margin Nonequilibrium Nonrolatile Normally off/on Numerical analysis Occupied band Official Offset On standby Ohmic contact Open circuit Operating point Operating bias Operational amplifier (OPAMP) Optical photon =photon Optical quenching Optical transition Optical-coupled isolator Organic semiconductor Orientation Outline Out-of-contact mask Output characteristic Output voltage swing Overcompensation Over-current protection Over shoot Over-voltage protection Overload Overlap Oscillator Oxide Oxidation Oxide passivation Package Pad Parameter Parasitic effect Parasitic oscillation Passination Passivation Passive component Passive device Passive surface Parasitic transistor Peak-point voltage Peak voltage Permanent-storage circuit Period Periodic table Permeable - base Phase-lock loop Phase drift Phonon spectra Photo conduction Photo diode Photoelectric cell Photoelectric effect Photoenic devices Photolithographic process (photo) resist Pin Pinch offPinning of Fermi level Planar processPlanar transistorPlasmaPlezoelectric effectPoisson equationPoint contactPolarityPolycrystalPolymer semiconductorPoly -siliconPotential Potential barrierPotential wellPower dissipationPower transistorPreamplifierPrimary flatPrincipal axesPrint -circuit board(PCB)ProbabilityProbeProcessPropagation delayPseudopotential methodPunch throughPulse triggering/modulatingPulse Widen Modulator(PWM) Punchthrough Push-pull stage Quality factor Quantization Quantum efficiency Quantum mechanics Quasi – Fermi level Quartz Radiation conductivity Radiation damage Radiation flux density Radiation hardening Radiation protection Radiative - recombination Radioactive Reach through Reactive sputtering source Read diode Recombination Recovery diode Reciprocal lattice Recovery time Rectifier Rectifying contact Reference Refractive index Register Registration Regulate Relaxation lifetime Reliability Resonance Resistance Resistor Resistivity Regulator Relaxation Resonant frequency Response time Reverse Reverse bias Sampling circuit Sapphire Satellite valley Saturated current range Saturation region Saturation Scaled down Scattering Schockley diode Schottky Schottky barrier Schottky contact Schrodingen Scribing grid Secondary flat Seed crystal Segregation Selectivity Self aligned Self diffusion Semiconductor Semiconductor-controlled rectifier Sendsitivity Serial Series inductance Series inductance Settle time Sheet resistance Shield Short circuit Shot noise Shunt Sidewall capacitance Signal Silica glass Silicon Silicon carbide Silicon dioxide (SiO2) Silicon Nitride(Si3N4) Silicon On Insulator Siliver whiskers Simple cubic Single crystal Sink Skin effect Snap time Sneak path Sulethreshold Solar battery/cell Solid circuit Solid Solubility Sonband Source Source follower Space charge Specific heat(PT) Speed-power product Spherical Spin Split Spontaneous emission Spreading resistance Sputter Stacking fault Static characteristic Stimulated emission Stimulated recombination Storage time Stress Straggle Sublimation Substrate Substitutional Superlattice Supply Surface Surge capacity Subscript Switching time Switch Tailing Terminal Tensor Tensorial Thermal activation Thermal conductivity Thermal equilibrium Thermal Oxidation Thermal resistance Thermal sink Thermal velocity Thermoelectric potential Thick-film technique Thin-film hybrid IC Thin-Film Transistor(TFT) Threshlod Thyistor Transconductance Transfer characteristic Transfer electron Transfer function Transient Transistor aging(stress) Transit time Transition Transition-metal silica Transition probability Transition region Transport Transverse Trap Trapping Trapped charge Triangle generator Triboelectricity Trigger Trim Triple diffusion Truth table Tolerance ToleranceTunnel (ing) Tunnel current Turn over Turn-off time Ultraviolet Unijunction Unipolar Unit cell Unity-gain frequency Unilateral-switch Vacancy Vacuum Valence(value) band Value band edge Valence bond Vapour phase Varactor Varistor Vibration Voltage Wafer Wave equation Wave guide Wave number Wave -particle duality Wear-out Wire routing Work function Worst-case device Yield Zener breakdown Zone melting

1234

Haha, it’s like a small dictionary, thanks!

passerby118

I finally found it, thank you.

EdChen

So many!

zimiqi512

very good