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SSP7492N-C

Description
Power Field-Effect Transistor, 6.2A I(D), 150V, 0.088ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN AND LEAD FREE, MINIATURE, SOP-8
CategoryDiscrete semiconductor    The transistor   
File Size519KB,4 Pages
ManufacturerSECOS
Websitehttp://www.secosgmbh.com/
Environmental Compliance
Download Datasheet Parametric View All

SSP7492N-C Overview

Power Field-Effect Transistor, 6.2A I(D), 150V, 0.088ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HALOGEN AND LEAD FREE, MINIATURE, SOP-8

SSP7492N-C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionSMALL OUTLINE, R-PDSO-F5
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage150 V
Maximum drain current (Abs) (ID)6.2 A
Maximum drain current (ID)6.2 A
Maximum drain-source on-resistance0.088 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-F5
Number of components1
Number of terminals5
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)5 W
Maximum pulsed drain current (IDM)30 A
surface mountYES
Terminal formFLAT
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON
SSP7492N
Elektronische Bauelemente
6.2A, 150V, R
DS(ON)
88 m
N-Channel Enhancement MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
SOP-8PP
DESCRIPTION
These miniature surface mount MOSFETs utilize a high cell
density trench process to provide low R
DS(on)
and to ensure
minimal power loss and heat dissipation. Typical applications are
DC-DC converters and power management in portable and
battery-powered products such as computers, printers, PCMCIA cards,
cellular and cordless telephones.
FEATURES
Low R
DS(on)
provides higher efficiency and extends battery life.
Low thermal impedance copper leadframe SOP-8PP saves board
space.
Fast switching speed.
High performance trench technology.
PACKAGE INFORMATION
Package
SOP-8PP
MPQ
3K
Leader Size
13 inch
REF.
A
B
C
D
E
F
G
L
Millimeter
Min.
Max.
0.85
1.00
5.3 BSC.
0.15
0.25
3.8 BCS.
6.05 BCS.
0.03
0.30
4.35 BCS.
0.40
0.70
REF.
θ
b
c
d
e
f
g
Millimeter
Min.
Max.
0
°
10
°
5.2 BCS
0.30
0.50
1.27BSC
5.55 BCS.
0.10
0.40
1.2 BCS.
ABSOLUTE MAXIMUM RATINGS
(T
A
=25°C unless otherwise specified)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
1
Pulsed Drain Current
2
Continuous Source Current (Diode Conduction)
1
Power Dissipation
1
T
A
=25°C
T
A
=70°C
T
A
=25°C
T
A
=70°C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
J
, T
STG
Rating
150
±20
6.2
5
30
6.7
5
3.2
-55~150
Unit
V
V
A
A
A
W
°C
Operating Junction and Storage Temperature Range
Thermal Resistance Data
Maximum Junction to Ambient
1
t≦10 sec
Steady State
R
θJA
25
65
°C / W
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
18-Sep-2013 Rev. B
Page 1 of 4

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