Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE6710Q
MA000043164
P-MQFP-64-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
plastics
organic material
inorganic material
plastics
Substances
silicon
magnesium
silicon
nickel
copper
gold
brominated resin
carbon black
antimonytrioxide
epoxy resin
silicondioxide
lead
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
-
1333-86-4
1309-64-4
-
60676-86-0
7439-92-1
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
27.335
0.317
1.375
6.348
203.573
3.789
6.938
6.938
14.569
75.620
589.697
0.752
2.706
1.184
1.051
4.205
Average
Mass
[%]
2.89
0.03
0.15
0.67
21.51
0.40
0.73
0.73
1.54
7.99
62.31
0.08
0.29
0.13
0.11
0.44
28. August 2013
946.40 mg
Sum
[%]
2.89
Average
Mass
[ppm]
28883
335
1453
6708
22.36
0.40
215103
4003
7331
7331
15394
79903
73.30
623097
795
0.37
0.13
2859
1251
1111
0.55
4443
5554
1000000
3654
1251
733056
223599
4003
Sum
[ppm]
28883
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
non noble metal
noble metal
plastics
noble metal
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com