SPECIALTY TELECOM CIRCUIT, QCC32
| Parameter Name | Attribute value |
| Number of functions | 1 |
| Number of terminals | 32 |
| Maximum operating temperature | 85 Cel |
| Minimum operating temperature | -40 Cel |
| Rated supply voltage | 3 V |
| Processing package description | 5 × 5 MM, ROHS COMPLIANT, QFN-32 |
| Lead-free | Yes |
| EU RoHS regulations | Yes |
| state | ACTIVE |
| Craftsmanship | CMOS |
| packaging shape | SQUARE |
| Package Size | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| surface mount | Yes |
| Terminal form | NO |
| Terminal spacing | 0.5000 mm |
| terminal coating | NOT SPECIFIED |
| Terminal location | Four |
| Packaging Materials | UNSPECIFIED |
| Temperature level | INDUSTRIAL |
| Communication type | telecommunications circuits |
| RFFC5071SB | RFFC5071 | RFFC5071SQ | RFFC5071TR13 | RFFC5072SB | RFFC5072SQ | RFFC5072SR | RFFC5072 | |
|---|---|---|---|---|---|---|---|---|
| Description | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 | SPECIALTY TELECOM CIRCUIT, QCC32 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Maximum operating temperature | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
| Minimum operating temperature | -40 Cel | -40 Cel | -40 Cel | -40 Cel | -40 Cel | -40 Cel | -40 Cel | -40 Cel |
| Rated supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Processing package description | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 | 5 × 5 MM, ROHS COMPLIANT, QFN-32 |
| Lead-free | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| EU RoHS regulations | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| state | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Craftsmanship | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| packaging shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package Size | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| surface mount | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Terminal form | NO | NO | NO | NO | NO | NO | NO | NO |
| Terminal spacing | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm |
| terminal coating | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Terminal location | Four | Four | Four | Four | Four | Four | Four | Four |
| Packaging Materials | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Communication type | telecommunications circuits | telecommunications circuits | telecommunications circuits | telecommunications circuits | telecommunications circuits | telecommunications circuits | telecommunications circuits | telecommunications circuits |
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