RFFC5072SR datasheet, PDF - EEWORLD Datasheet

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RFFC5072SR: DescriptionSPECIALTY TELECOM CIRCUIT, QCC32; CategoryTopical application Wireless rf/communication; File Size3MB，20 Pages; ManufacturerRF Micro Devices (Qorvo)

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RFFC5072SR Overview

SPECIALTY TELECOM CIRCUIT, QCC32

RFFC5072SR Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Rated supply voltage	3 V
Processing package description	5 × 5 MM, ROHS COMPLIANT, QFN-32
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
Craftsmanship	CMOS
packaging shape	SQUARE
Package Size	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mount	Yes
Terminal form	NO
Terminal spacing	0.5000 mm
terminal coating	NOT SPECIFIED
Terminal location	Four
Packaging Materials	UNSPECIFIED
Temperature level	INDUSTRIAL
Communication type	telecommunications circuits

RFFC5072SR Related Products

	RFFC5072SR	RFFC5071	RFFC5071SQ	RFFC5071TR13	RFFC5072SB	RFFC5072SQ	RFFC5071SB	RFFC5072
Description	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32	SPECIALTY TELECOM CIRCUIT, QCC32
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Rated supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Processing package description	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32	5 × 5 MM, ROHS COMPLIANT, QFN-32
Lead-free	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
EU RoHS regulations	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	NO	NO	NO	NO	NO	NO	NO	NO
Terminal spacing	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm
terminal coating	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal location	Four	Four	Four	Four	Four	Four	Four	Four
Packaging Materials	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Communication type	telecommunications circuits	telecommunications circuits	telecommunications circuits	telecommunications circuits	telecommunications circuits	telecommunications circuits	telecommunications circuits	telecommunications circuits

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