Parallel D Register with Enable
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | CERAMIC, LCC-20 |
| Reach Compliance Code | unknown |
| Other features | WITH HOLD MODE |
| series | F/FAST |
| JESD-30 code | S-CQCC-N20 |
| JESD-609 code | e0 |
| length | 8.89 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 70000000 Hz |
| MaximumI(ol) | 0.02 A |
| Number of digits | 6 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 45 mA |
| propagation delay (tpd) | 10.5 ns |
| Certification status | Not Qualified |
| Maximum seat height | 1.905 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| width | 8.89 mm |
| minfmax | 70 MHz |
| Base Number Matches | 1 |
| 54F378LM | 54F378DM | 54F378FM | 74F378SC | 74F378SJ | |
|---|---|---|---|---|---|
| Description | Parallel D Register with Enable | Parallel D Register with Enable | Parallel D Register with Enable | Parallel D Register with Enable | Parallel D Register with Enable |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | - |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - |
| package instruction | CERAMIC, LCC-20 | DIP-16 | CERPACK-16 | - | - |
| Reach Compliance Code | unknown | unknown | unknown | - | - |
| Other features | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | - | - |
| series | F/FAST | F/FAST | F/FAST | - | - |
| JESD-30 code | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | - | - |
| JESD-609 code | e0 | e0 | e0 | - | - |
| length | 8.89 mm | 19.43 mm | 9.6645 mm | - | - |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | - | - |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - |
| Maximum Frequency@Nom-Sup | 70000000 Hz | 70000000 Hz | 70000000 Hz | - | - |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | - | - |
| Number of digits | 6 | 6 | 6 | - | - |
| Number of functions | 1 | 1 | 1 | - | - |
| Number of terminals | 20 | 16 | 16 | - | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | - | - |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - |
| Output polarity | TRUE | TRUE | TRUE | - | - |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - |
| encapsulated code | QCCN | DIP | DFP | - | - |
| Encapsulate equivalent code | LCC20,.35SQ | DIP16,.3 | FL16,.3 | - | - |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | - | - |
| Package form | CHIP CARRIER | IN-LINE | FLATPACK | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| power supply | 5 V | 5 V | 5 V | - | - |
| Maximum supply current (ICC) | 45 mA | 45 mA | 45 mA | - | - |
| propagation delay (tpd) | 10.5 ns | 8.5 ns | 10.5 ns | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | - |
| Maximum seat height | 1.905 mm | 5.08 mm | 2.032 mm | - | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - | - |
| surface mount | YES | NO | YES | - | - |
| technology | TTL | TTL | TTL | - | - |
| Temperature level | MILITARY | MILITARY | MILITARY | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | NO LEAD | THROUGH-HOLE | FLAT | - | - |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | - | - |
| Terminal location | QUAD | DUAL | DUAL | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - |
| width | 8.89 mm | 7.62 mm | 6.604 mm | - | - |
| minfmax | 70 MHz | 80 MHz | 70 MHz | - | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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