MB81C1000A-70LP datasheet, PDF

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MB81C1000A-70LP: DescriptionFast Page DRAM, 1MX1, 70ns, CMOS, PDIP18; Categorystorage storage; File Size677KB，25 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB81C1000A-70LP Overview

Fast Page DRAM, 1MX1, 70ns, CMOS, PDIP18

MB81C1000A-70LP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	70 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	FAST PAGE DRAM
memory width	1
Number of terminals	18
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum standby current	0.00025 A
Maximum slew rate	0.068 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MB81C1000A-70LP Related Products

	MB81C1000A-70LP	MB81C1000A-80LPFTR	MB81C1000A-70LPFTN	MB81C1000A-80LP	MB81C1000A-80LPJ	MB81C1000A-80LPSZ	MB81C1000A-80LPFTN	MB81C1000A-10LPJ	MB81C1000A-10LP
Description	Fast Page DRAM, 1MX1, 70ns, CMOS, PDIP18	Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20	Fast Page DRAM, 1MX1, 70ns, CMOS, PDSO20	Fast Page DRAM, 1MX1, 80ns, CMOS, PDIP18	Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20	Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP20	Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20	Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20	Fast Page DRAM, 1MX1, 100ns, CMOS, PDIP18
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOIC	SOIC	DIP	SOJ	ZIP	SOIC	SOJ	DIP
package instruction	DIP, DIP18,.3	TSSOP, TSSOP20/24,.63,20	TSSOP, TSSOP20/24,.63,20	DIP, DIP18,.3	SOJ, SOJ20/26,.34	ZIP, ZIP20,.1	TSSOP, TSSOP20/24,.63,20	SOJ, SOJ20/26,.34	DIP, DIP18,.3
Contacts	18	20	20	18	20	20	20	20	18
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	70 ns	80 ns	70 ns	80 ns	80 ns	80 ns	80 ns	100 ns	100 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T18	R-PDSO-G20	R-PDSO-G20	R-PDIP-T18	R-PDSO-J20	R-PZIP-T20	R-PDSO-G20	R-PDSO-J20	R-PDIP-T18
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	1	1	1	1	1	1	1	1	1
Number of terminals	18	20	20	18	20	20	20	20	18
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	TSSOP	DIP	SOJ	ZIP	TSSOP	SOJ	DIP
Encapsulate equivalent code	DIP18,.3	TSSOP20/24,.63,20	TSSOP20/24,.63,20	DIP18,.3	SOJ20/26,.34	ZIP20,.1	TSSOP20/24,.63,20	SOJ20/26,.34	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512	512	512	512
Maximum standby current	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A
Maximum slew rate	0.068 mA	0.062 mA	0.068 mA	0.062 mA	0.062 mA	0.062 mA	0.062 mA	0.054 mA	0.054 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	0.5 mm	0.5 mm	2.54 mm	1.27 mm	1.27 mm	0.5 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG	DUAL	DUAL	DUAL
Maker	-	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU	-

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