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MB81C1000A-80LPFTN

Description
Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20
Categorystorage    storage   
File Size677KB,25 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MB81C1000A-80LPFTN Overview

Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20

MB81C1000A-80LPFTN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFUJITSU
Parts packaging codeSOIC
package instructionTSSOP, TSSOP20/24,.63,20
Contacts20
Reach Compliance Codeunknown
Maximum access time80 ns
I/O typeSEPARATE
JESD-30 codeR-PDSO-G20
JESD-609 codee0
memory density1048576 bit
Memory IC TypeFAST PAGE DRAM
memory width1
Number of terminals20
word count1048576 words
character code1000000
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP20/24,.63,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum standby current0.00025 A
Maximum slew rate0.062 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL

MB81C1000A-80LPFTN Related Products

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Description Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 70ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDIP18 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP20 Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 100ns, CMOS, PDIP18 Fast Page DRAM, 1MX1, 70ns, CMOS, PDIP18
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC DIP SOJ ZIP SOJ DIP DIP
package instruction TSSOP, TSSOP20/24,.63,20 TSSOP, TSSOP20/24,.63,20 TSSOP, TSSOP20/24,.63,20 DIP, DIP18,.3 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 DIP, DIP18,.3 DIP, DIP18,.3
Contacts 20 20 20 18 20 20 20 18 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 80 ns 80 ns 70 ns 80 ns 80 ns 80 ns 100 ns 100 ns 70 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDIP-T18 R-PDSO-J20 R-PZIP-T20 R-PDSO-J20 R-PDIP-T18 R-PDIP-T18
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 18 20 20 20 18 18
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP DIP SOJ ZIP SOJ DIP DIP
Encapsulate equivalent code TSSOP20/24,.63,20 TSSOP20/24,.63,20 TSSOP20/24,.63,20 DIP18,.3 SOJ20/26,.34 ZIP20,.1 SOJ20/26,.34 DIP18,.3 DIP18,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512
Maximum standby current 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A
Maximum slew rate 0.062 mA 0.062 mA 0.068 mA 0.062 mA 0.062 mA 0.062 mA 0.054 mA 0.054 mA 0.068 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL ZIG-ZAG DUAL DUAL DUAL
Maker FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU - -

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