SN74ALS232BDW datasheet, PDF - EEWORLD Datasheet

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SN74ALS232BDW: Description16 x 4 asynchronous FIFO memory 16-SOIC 0 to 70; Categorystorage storage; File Size305KB，12 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74ALS232BDW Overview

16 x 4 asynchronous FIFO memory 16-SOIC 0 to 70

SN74ALS232BDW Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	SOP, SOP16,.4
Contacts	16
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Maximum access time	30 ns
Maximum clock frequency (fCLK)	40 MHz
period time	25 ns
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	10.3 mm
memory density	64 bi
Memory IC Type	OTHER FIFO
memory width	4
Humidity sensitivity level	1
Number of functions	1
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16X4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum slew rate	0.125 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.5 mm

SN74ALS232BDW Related Products

	SN74ALS232BDW	SN74ALS232BN
Description	16 x 4 asynchronous FIFO memory 16-SOIC 0 to 70	16 x 4 asynchronous FIFO memory 16-PDIP 0 to 70
Brand Name	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	incompatible
Maker	Texas Instruments	Texas Instruments
Parts packaging code	SOIC	DIP
package instruction	SOP, SOP16,.4	DIP, DIP16,.3
Contacts	16	16
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Factory Lead Time	1 week	1 week
Maximum access time	30 ns	30 ns
Maximum clock frequency (fCLK)	40 MHz	40 MHz
period time	25 ns	25 ns
JESD-30 code	R-PDSO-G16	R-PDIP-T16
JESD-609 code	e4	e4
length	10.3 mm	19.305 mm
memory density	64 bi	64 bi
Memory IC Type	OTHER FIFO	OTHER FIFO
memory width	4	4
Number of functions	1	1
Number of terminals	16	16
word count	16 words	16 words
character code	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	16X4	16X4
Output characteristics	3-STATE	3-STATE
Exportable	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP
Encapsulate equivalent code	SOP16,.4	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	5.08 mm
Maximum slew rate	0.125 mA	0.125 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	7.5 mm	7.62 mm

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