Preliminary
RT9004
300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator
General Description
The RT9004 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9004 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. Regulator ground current increases
only slightly in dropout, further prolonging the battery life.
The RT9004 also works with low-ESR ceramic capacitors,
reducing the amount of board space necessary for power
applications, critical in hand-held wireless devices. The
RT9004 consumes less than 0.01uA in shutdown mode
and has fast turn-on time less than 50us. RT9004 is short
circuit thermal folded back protected. RT9004 lowers its
OTP trip point from 165°C to 110°C when output short
circuit occurs (V
OUT
< 0.4V) providing maximum safety to
end users. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio. Available in the VDFN-10L
3x3 and WDFN-10L 3x3 packages, the RT9004 also offers
custom voltage, range of 1.5V to 3.5V with 0.1V per step.
Features
Short Circuit Thermal Folded Back Protection
Low-Noise for RF Application
Fast Response in Line/Load Transient
Quick Start-Up (Typically 50us)
Low Dropout : 220mV @ 300mA
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Thermal Shutdown Protection
Only 1uF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
Small 10-Lead VDFN and WDFN Packages
RoHS Compliant and 100% Lead (Pb)-Free
Applications
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Ordering Information
RT9004
Package Type
QV : VDFN-10L 3x3 (V-Type)
QW : WDFN-10L 3x3 (W-Type)
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commer-
cial Standard)
Voltage Version : VOUT1/VOUT2/VOUT3
A : 2.8V/2.5V/1.8V
B : 3.0V/2.5V/1.8V
C : 2.8V/2.8V/1.8V
D : 2.8V/1.8V/1.8V
E : 3.3V/2.8V/1.8V
F : 3.3V/2.8V/2.8V
G : 2.5V/2.8V/2.5V
H : 2.8V/2.8V/1.5V
J : 1.5V/3.3V/3.3V
K : 3.0V/3.0V/1.8V
Pin Configurations
(TOP VIEW)
VOUT1
VOUT2
GND
VOUT3
EN3
1
2
3
4
5
11
10
GND
VIN1
9
EN1
8
VIN2
7
EN2
VIN3
9
V/WDFN-10L 3x3
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area, otherwise visit our website for detail.
Note :
Richtek Pb-free and Green products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
100% matte tin (Sn) plating.
DS9004-00 February 2008
www.richtek.com
1
RT9004
Typical Application Circuit
V
IN
C
IN
2.2uF
Chip Enable
Chip Shutdown
Preliminary
RT9004
VIN1
VOUT1
VIN2
VIN3
EN1
EN2
EN3
VOUT2
VOUT3
C
OUT
1uF
V
OUT1
V
OUT2
V
OUT3
GND
V
IN1
V
IN2
V
IN3
Chip Enable
Chip Shutdown
C
IN
1uF
RT9004
VIN1
VOUT1
VIN2
VIN3
VOUT2
VOUT3
C
OUT
1uF
V
OUT1
V
OUT2
V
OUT3
EN1
EN2
EN3
GND
Functional Pin Description
Pin Number
1
2
3
Exposed Pad (11)
4
5
6
7
8
9
10
Pin Nam e
VOUT1
VOUT2
GND
VOUT3
EN3
VIN3
EN2
VIN2
EN1
VIN1
Output Voltage 1.
Output Voltage 2.
Ground. The exposed pad must be soldered to a large PCB and connected to GND
for maximum power dissipation.
Output Voltage 3.
Chip Enable 3 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 3.
Chip Enable 2 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 2.
Chip Enable 1 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 1.
Pin Function
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2
DS9004-00 February 2008
RT9004
Absolute Maximum Ratings
Power Dissipation, P
D
@ T
A
= 25°C
Preliminary
(Note 1)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 6.0V
V/WDFN-10L 3x3 ---------------------------------------------------------------------------------------------------------- 0.952 W
Package Thermal Resistance (Note 4)
V/WDFN-10L 3x3,
θ
JA
---------------------------------------------------------------------------------------------------- 105°C/W
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10sec.) -------------------------------------------------------------------------------- 260°C
Storage Temperature Range --------------------------------------------------------------------------------------------
−
65°C to 125°C
ESD Susceptibility (Note 2)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V
Recommended Operating Conditions
(Note 3)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
Operation Ambient Temperature Range ------------------------------------------------------------------------------
−40°C
to 85°C
Operation Junction Temperature Range ------------------------------------------------------------------------------
−40°C
to 125°C
Electrical Characteristics
(V
IN
= V
OUT
+ 1V, C
IN
= C
OUT
= 1μF, T
A
= 25°C, unless otherwise specified)
Parameter
Output Voltage Accuracy
Current Limit
Quiescent Current
Dropout Voltage (Note 4)
Line Regulation
Load Regulation
Standby Current
EN Input Bias Current
EN Threshold
Power Supply
Rejection Rate
Logic-Low Voltage
Symbol
ΔV
OUT
I
LIM
I
Q
V
DROP
ΔV
LINE
Test Conditions
I
OUT
= 1mA
R
LOAD
= 1Ω
V
EN
>= 1.2V, I
OUT
= 0mA
I
OUT
= 200mA
I
OUT
= 300mA
V
IN
= (V
OUT
+ 1V) to 5.5V,
I
OUT
= 1mA
Min
−2
360
--
--
--
--
--
--
--
--
1.2
--
--
--
--
--
Typ
--
400
90
170
220
--
--
0.01
0
--
--
−60
−30
165
30
110
Max
+2
--
--
--
--
0.3
0.6
1
100
0.4
--
--
--
--
--
--
Units
%
mA
μA
mV
%
%
μA
nA
V
ΔV
LOAD
1mA < I
OUT
< 300mA
I
STBY
I
IBSD
V
IL
V
EN
= GND, Shutdown
V
EN
= GND or VIN
V
IN
= 3V to 5.5V, Shutdown
V
IN
= 3V to 5.5V, Start-Up
C
OUT
= 1μF, I
OUT
= 100mA
Logic-High Voltage V
IH
f = 100Hz
f = 10kHz
PSRR
T
SD
ΔT
SD
ΔT
TFB
dB
°C
°C
°C
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Thermal Folded Back Temperature
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4
DS9004-00 February 2008
Preliminary
RT9004
Note 1.
Stresses listed as the above
“Absolute
Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2.
Devices are ESD sensitive. Handling precaution is recommended.
Note 3.
The device is not guaranteed to function outside its operating conditions.
Note 4.
θ
JA
is measured in the natural convection at T
A
= 25°C on a low effective thermal conductivity test board (single-later,
1s) of JEDEC 51-3 thermal measurement standard.
DS9004-00 February 2008
www.richtek.com
5
GD32 MCU
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