60 A, 500 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-264AA
Parameter Name | Attribute value |
Number of terminals | 3 |
Minimum breakdown voltage | 500 V |
Processing package description | PLASTIC, TO-264, 3 PIN |
Lead-free | Yes |
EU RoHS regulations | Yes |
state | ACTIVE |
packaging shape | RECTANGULAR |
Package Size | FLANGE MOUNT |
Terminal form | THROUGH-HOLE |
terminal coating | TIN SILVER COPPER |
Terminal location | SINGLE |
Packaging Materials | PLASTIC/EPOXY |
structure | SINGLE WITH BUILT-IN DIODE |
Shell connection | DRAIN |
Number of components | 1 |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Channel type | N-CHANNEL |
field effect transistor technology | METAL-OXIDE SEMICONDUCTOR |
operating mode | ENHANCEMENT |
Transistor type | GENERAL PURPOSE POWER |
Maximum leakage current | 60 A |
Rated avalanche energy | 3000 mJ |
Maximum drain on-resistance | 0.1000 ohm |
Maximum leakage current pulse | 150 A |
PLUS247 | IXTX60N50L2 | IXTK60N50L2 | |
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Description | 60 A, 500 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-264AA | 60 A, 500 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-264AA | 60 A, 500 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-264AA |
Number of terminals | 3 | 3 | 3 |
Minimum breakdown voltage | 500 V | 500 V | 500 V |
Processing package description | PLASTIC, TO-264, 3 PIN | PLASTIC, TO-264, 3 PIN | PLASTIC, TO-264, 3 PIN |
Lead-free | Yes | Yes | Yes |
EU RoHS regulations | Yes | Yes | Yes |
state | ACTIVE | ACTIVE | ACTIVE |
packaging shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package Size | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
terminal coating | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
Terminal location | SINGLE | SINGLE | SINGLE |
Packaging Materials | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
structure | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Shell connection | DRAIN | DRAIN | DRAIN |
Number of components | 1 | 1 | 1 |
transistor applications | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON |
Channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL |
field effect transistor technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
operating mode | ENHANCEMENT | ENHANCEMENT | ENHANCEMENT |
Transistor type | GENERAL PURPOSE POWER | GENERAL PURPOSE POWER | GENERAL PURPOSE POWER |
Maximum leakage current | 60 A | 60 A | 60 A |
Rated avalanche energy | 3000 mJ | 3000 mJ | 3000 mJ |
Maximum drain on-resistance | 0.1000 ohm | 0.1000 ohm | 0.1000 ohm |
Maximum leakage current pulse | 150 A | 150 A | 150 A |