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PL87X288B

Description
(32 X 8) 256-BIT TTL LOGIC PROMS
File Size112KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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PL87X288B Overview

(32 X 8) 256-BIT TTL LOGIC PROMS

PL87X288B Related Products

PL87X288B PL87X288BJ PL87X288BN PL87X288BV
Description (32 X 8) 256-BIT TTL LOGIC PROMS (32 X 8) 256-BIT TTL LOGIC PROMS (32 X 8) 256-BIT TTL LOGIC PROMS (32 X 8) 256-BIT TTL LOGIC PROMS
Is it Rohs certified? - incompatible incompatible incompatible
package instruction - CERAMIC, DIP-16 DIP, DIP16,.3 QCCJ, LDCC20,.4SQ
Reach Compliance Code - unknow unknow unknow
ECCN code - EAR99 EAR99 EAR99
Is Samacsys - N N N
Maximum access time - 15 ns 15 ns 15 ns
JESD-30 code - R-GDIP-T16 R-PDIP-T16 S-PQCC-J20
JESD-609 code - e0 e0 e0
length - 19.43 mm 21.755 mm 8.89 mm
memory density - 256 bi 256 bi 256 bi
Memory IC Type - OTP ROM OTP ROM OTP ROM
memory width - 8 8 8
Number of functions - 1 1 1
Number of terminals - 16 16 20
word count - 32 words 32 words 32 words
character code - 32 32 32
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 70 °C 70 °C 70 °C
organize - 32X8 32X8 32X8
Output characteristics - 3-STATE 3-STATE 3-STATE
Package body material - CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP DIP QCCJ
Encapsulate equivalent code - DIP16,.3 DIP16,.3 LDCC20,.4SQ
Package shape - RECTANGULAR RECTANGULAR SQUARE
Package form - IN-LINE IN-LINE CHIP CARRIER
Parallel/Serial - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V
Certification status - Not Qualified Not Qualified Not Qualified
Maximum seat height - 5.08 mm 5.08 mm 4.57 mm
Maximum slew rate - 0.14 mA 0.14 mA 0.14 mA
Maximum supply voltage (Vsup) - 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) - 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V
surface mount - NO NO YES
technology - BIPOLAR BIPOLAR BIPOLAR
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch - 2.54 mm 2.54 mm 1.27 mm
Terminal location - DUAL DUAL QUAD
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm 7.62 mm 8.89 mm
Base Number Matches - 1 1 1

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