PL87X288BN datasheet, PDF - EEWORLD Datasheet

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PL87X288BN: Description(32 X 8) 256-BIT TTL LOGIC PROMS; Categorystorage storage; File Size112KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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PL87X288BN Overview

(32 X 8) 256-BIT TTL LOGIC PROMS

PL87X288BN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknow
ECCN code	EAR99
Is Samacsys	N
Maximum access time	15 ns
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
length	21.755 mm
memory density	256 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	16
word count	32 words
character code	32
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32X8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

PL87X288BN Related Products

	PL87X288BN	PL87X288B	PL87X288BJ	PL87X288BV
Description	(32 X 8) 256-BIT TTL LOGIC PROMS	(32 X 8) 256-BIT TTL LOGIC PROMS	(32 X 8) 256-BIT TTL LOGIC PROMS	(32 X 8) 256-BIT TTL LOGIC PROMS
Is it Rohs certified?	incompatible	-	incompatible	incompatible
package instruction	DIP, DIP16,.3	-	CERAMIC, DIP-16	QCCJ, LDCC20,.4SQ
Reach Compliance Code	unknow	-	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99
Is Samacsys	N	-	N	N
Maximum access time	15 ns	-	15 ns	15 ns
JESD-30 code	R-PDIP-T16	-	R-GDIP-T16	S-PQCC-J20
JESD-609 code	e0	-	e0	e0
length	21.755 mm	-	19.43 mm	8.89 mm
memory density	256 bi	-	256 bi	256 bi
Memory IC Type	OTP ROM	-	OTP ROM	OTP ROM
memory width	8	-	8	8
Number of functions	1	-	1	1
Number of terminals	16	-	16	20
word count	32 words	-	32 words	32 words
character code	32	-	32	32
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C
organize	32X8	-	32X8	32X8
Output characteristics	3-STATE	-	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	-	DIP	QCCJ
Encapsulate equivalent code	DIP16,.3	-	DIP16,.3	LDCC20,.4SQ
Package shape	RECTANGULAR	-	RECTANGULAR	SQUARE
Package form	IN-LINE	-	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	-	5 V	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	-	5.08 mm	4.57 mm
Maximum slew rate	0.14 mA	-	0.14 mA	0.14 mA
Maximum supply voltage (Vsup)	5.25 V	-	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	-	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V
surface mount	NO	-	NO	YES
technology	BIPOLAR	-	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	-	2.54 mm	1.27 mm
Terminal location	DUAL	-	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	-	7.62 mm	8.89 mm
Base Number Matches	1	-	1	1

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