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MPC855TZQ50D4R2

Description
32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
Categorysemiconductor    The embedded processor and controller   
File Size926KB,80 Pages
ManufacturerFREESCALE (NXP)
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MPC855TZQ50D4R2 Overview

32-BIT, 50 MHz, RISC PROCESSOR, PBGA357

MPC855TZQ50D4R2 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals357
Maximum supply/operating voltage3.46 V
Minimum supply/operating voltage3.14 V
Rated supply voltage3.3 V
External data bus width32
Line speed50 MHz
Processing package description25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
stateACTIVE
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeGRID ARRAY
surface mountYes
Terminal formBALL
Terminal spacing1.27 mm
terminal coatingTIN LEAD
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Address bus width32
Number of digits32
boundary scanYes
Maximum FCLK clock frequency50 MHz
Integrated cacheYes
low power modeYes
Microprocessor typeRISC PROCESSOR

MPC855TZQ50D4R2 Related Products

MPC855TZQ50D4R2 MPC855TCZQ66D4 MPC855TUM MPC855TZQ80D4 MPC860SR MPC860T MPC860UM
Description 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
Number of functions 1 1 1 1 1 1 1
Number of terminals 357 357 357 357 357 357 357
Maximum supply/operating voltage 3.46 V 3.46 V 3.46 V 3.46 V 3.46 V 3.46 V 3.46 V
Minimum supply/operating voltage 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
External data bus width 32 32 32 32 32 32 32
Line speed 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Processing package description 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Craftsmanship CMOS CMOS CMOS CMOS CMOS CMOS CMOS
packaging shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package Size GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
surface mount Yes Yes Yes Yes Yes Yes Yes
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal spacing 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
terminal coating TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Address bus width 32 32 32 32 32 32 32
Number of digits 32 32 32 32 32 32 32
boundary scan Yes Yes Yes Yes Yes Yes Yes
Maximum FCLK clock frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Integrated cache Yes Yes Yes Yes Yes Yes Yes
low power mode Yes Yes Yes Yes Yes Yes Yes
Microprocessor type RISC PROCESSOR RISC PROCESSOR RISC PROCESSOR RISC PROCESSOR RISC PROCESSOR RISC PROCESSOR RISC PROCESSOR

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