MPC855TUM datasheet, PDF - EEWORLD Datasheet

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MPC855TUM: Description32-BIT, 50 MHz, RISC PROCESSOR, PBGA357; Categorysemiconductor The embedded processor and controller; File Size926KB，80 Pages; ManufacturerFREESCALE (NXP)

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MPC855TUM Overview

32-BIT, 50 MHz, RISC PROCESSOR, PBGA357

MPC855TUM Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	357
Maximum supply/operating voltage	3.46 V
Minimum supply/operating voltage	3.14 V
Rated supply voltage	3.3 V
External data bus width	32
Line speed	50 MHz
Processing package description	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
state	ACTIVE
Craftsmanship	CMOS
packaging shape	SQUARE
Package Size	GRID ARRAY
surface mount	Yes
Terminal form	BALL
Terminal spacing	1.27 mm
terminal coating	TIN LEAD
Terminal location	BOTTOM
Packaging Materials	PLASTIC/EPOXY
Address bus width	32
Number of digits	32
boundary scan	Yes
Maximum FCLK clock frequency	50 MHz
Integrated cache	Yes
low power mode	Yes
Microprocessor type	RISC PROCESSOR

MPC855TUM Related Products

	MPC855TUM	MPC855TCZQ66D4	MPC855TZQ50D4R2	MPC855TZQ80D4	MPC860SR	MPC860T	MPC860UM
Description	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
Number of functions	1	1	1	1	1	1	1
Number of terminals	357	357	357	357	357	357	357
Maximum supply/operating voltage	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V	3.46 V
Minimum supply/operating voltage	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Rated supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
External data bus width	32	32	32	32	32	32	32
Line speed	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
Processing package description	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal spacing	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
terminal coating	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Packaging Materials	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Address bus width	32	32	32	32	32	32	32
Number of digits	32	32	32	32	32	32	32
boundary scan	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Maximum FCLK clock frequency	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
Integrated cache	Yes	Yes	Yes	Yes	Yes	Yes	Yes
low power mode	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Microprocessor type	RISC PROCESSOR	RISC PROCESSOR	RISC PROCESSOR	RISC PROCESSOR	RISC PROCESSOR	RISC PROCESSOR	RISC PROCESSOR

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