WF128K32N-150HM datasheet, PDF

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WF128K32N-150HM: DescriptionFlash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size719KB，17 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WF128K32N-150HM Overview

Flash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WF128K32N-150HM Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	150 ns
Other features	CONFIGURABLE AS 128K X 32
Spare memory width	16
JESD-30 code	S-CPGA-P66
length	30.1 mm
memory density	4194304 bit
Memory IC Type	FLASH MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Programming voltage	12 V
Certification status	Not Qualified
Maximum seat height	6.22 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	30.1 mm

WF128K32N-150HM Related Products

	WF128K32N-150HM	WF128K32N-120HI	WF128K32N-120HM	WF128K32N-150HI
Description	Flash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	Flash Module, 512KX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	Flash Module, 512KX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	Flash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Maker	Microsemi	Microsemi	Microsemi	Microsemi
package instruction	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66	1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	150 ns	120 ns	120 ns	150 ns
Other features	CONFIGURABLE AS 128K X 32	CONFIGURABLE AS 128K X 32	CONFIGURABLE AS 128K X 32	CONFIGURABLE AS 128K X 32
Spare memory width	16	16	16	16
JESD-30 code	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66
length	30.1 mm	30.1 mm	30.1 mm	30.1 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	66	66	66	66
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-40 °C
organize	512KX8	512KX8	512KX8	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	12 V	12 V	12 V	12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	6.22 mm	6.22 mm	6.22 mm	6.22 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
width	30.1 mm	30.1 mm	30.1 mm	30.1 mm

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