MT18LSDT6472G-10E datasheet, PDF

MT18LSDT6472G-10E: DescriptionSynchronous DRAM Module, 64MX72, 6ns, CMOS, PDMA168,; Categorystorage storage; File Size811KB，27 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT18LSDT6472G-10E Overview

Synchronous DRAM Module, 64MX72, 6ns, CMOS, PDMA168,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
package instruction	DIMM, DIMM168
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	6 ns
Maximum clock frequency (fCLK)	125 MHz
I/O type	COMMON
JESD-30 code	R-PDMA-N168
memory density	4831838208 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of terminals	168
word count	67108864 words
character code	64000000
Maximum operating temperature	55 °C
Minimum operating temperature
organize	64MX72
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum standby current	0.036 A
Maximum slew rate	4.86 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

	MT18LSDT6472G-10E	MT18LSDT12872G-10E
Description	Synchronous DRAM Module, 64MX72, 6ns, CMOS, PDMA168,	Synchronous DRAM Module, 128MX72, 6ns, CMOS, PDMA168,
Is it Rohs certified?	incompatible	incompatible
Maker	Micron Technology	Micron Technology
package instruction	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	6 ns	6 ns
Maximum clock frequency (fCLK)	125 MHz	125 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-PDMA-N168	R-PDMA-N168
memory density	4831838208 bit	9663676416 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72
Number of terminals	168	168
word count	67108864 words	134217728 words
character code	64000000	128000000
Maximum operating temperature	55 °C	55 °C
organize	64MX72	128MX72
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	8192	8192
Maximum standby current	0.036 A	0.036 A
Maximum slew rate	4.86 mA	6.66 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL

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