LMV225TL datasheet, PDF - EEWORLD Datasheet

LMV225TL: DescriptionTELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO6; CategoryWireless rf/communication Telecom circuit; File Size1MB，21 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMV225TL Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO6

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4
Reach Compliance Code	_compli
JESD-30 code	S-PBGA-B4
JESD-609 code	e0
length	1.014 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	4
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	0.675 mm
Nominal supply voltage	2.7 V
surface mount	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	1.014 mm

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