Advanced PCI Audio Accelerator
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | TFQFP, QFP100,.63SQ,20 |
Reach Compliance Code | unknow |
Commercial integrated circuit types | CONSUMER CIRCUIT |
JESD-30 code | S-PQFP-G100 |
JESD-609 code | e0 |
length | 14 mm |
Number of functions | 1 |
Number of terminals | 100 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFQFP |
Encapsulate equivalent code | QFP100,.63SQ,20 |
Package shape | SQUARE |
Package form | FLATPACK, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum slew rate | 50 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |