NEW
High-Speed(10
+
Gbps) BGA Mezzanine Connectors
IT3 Series
sFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10
+
Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
sMechanical
features
q
Unique 3-piece structure for flexibility
q
Stacking heights from 15 to 40mm
(
*
15mmH is 2-piece)
q
Staggered 1.5mm
∞
1.75mm ball grid array
q
Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
q
Differential, single-ended, and power
q
Low mating/extracting forces
q
Wide misalignment tolerances for multiple
connector use
q
Both of SnPb and Pb-free are available
q
Excellent reflow solderability
Interposer
Signal
Ground
Signal / Ground Configuration
sSignal
integrity features
q
Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10
+
Gbps
with skipped pin assignment.
60
50
40
ICR (dB)
30
20
10
0
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
RL (dB)
0
5
10
Frequency (GHz)
15
20
-20
ICR
IEEE spec
0
-10
q
Return Loss
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
-30
-50
sStacking
height variations
Stacking Height
Contact Position
100
200
300
17mm
*
20mm
22mm
*
25mm
26mm
28mm
30mm
*
32mm
*
38mm
40mm
* : Under planning
2010.02
1
IT3 SeriesqHigh-Speed(10
+
Gbps) BGA Mezzanine Connectors
sProduct
Specifications
Rating
Current Rating: 1.0A / pin (note 1)
Voltage Rating: 50Vrms
Storage Temperature Range: -10˚C to +60˚C
Operating Temperature Range: -55˚C to +85˚C
Operating Humidity Range: For relative humidity,
90% max (no condensation is permitted)
Conditions
100V DC
150V duty for 60 seconds (2mA max leak)
100mA
Frequency: 20 to 500Hz; power spectrum density: 0.02G
2
/Hz
Overall rms G: 3.1 Grms; for 15 minutes in three directions
25˚C, 80% RH: 60 min dwell time, 30 min ramp time
65˚C, 50% RH: 60 min dwell time under 24 cycles
100 cycles
Item
Specification
1. Insulation Resistance
1000Mø min.
2. Withstanding Voltage
No flashover or insulation breakdown
50mø max. (height 15-24mm) (note 2)
3. Contact Resistance
55mø max. (height 25-32mm)
60mø max. (height 33-40mm)
1) No electrical discontinuity of 1µs or more
4. Vibration
2) No damage, crack, or loose part
1) Contact resistance change: 20mø or less
5. Cyclic Temperature
2) Insulation resistance: 100Mø min.
and Humidity
3) No damage, crack or loose part
6. Durability
1) Contact resistance change: 20mø or less
(Mating/Un-mating)
2) No damage, crack or loose part
Note1: Refer to IT3 derating curves on test report TR636E-20041 for power application.
Note2: The value of contact resistance includes 2 contact points and the bulk resistance.
sMaterial
Information
qReceptacle
Component
Housing
Locator
Contact
Solder Ball
Tray
Pick Up Cap
Pick Up Tape
Material
LCP
LCP
Copper Alloy
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Paper (Nomex)
Finish & Remarks
Black , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Mounting Area : Gold (0.03 µm) over Nickel (1.5 µm)
Other
: Nickel (1.5 µm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Black
300pos
100pos and 200pos
qInterposer
Component
Guide (Mounting Side)
Guide (Detachable/Mating Side)
Blade
Contact
Ground Shield
Tray
Material
PBT
LCP
PBT
LCP
Copper Alloy
Copper Alloy
Polypropylene
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Other
: Nickel (1.5 µm)
----------
2
IT3 SeriesqHigh-Speed(10
+
Gbps) BGA Mezzanine Connectors
sOrdering
Information
qReceptacle
IT 3
**
-
***
S - BGA
**
(
**
)
1
2
3
4
5
6
7
qInterposer
IT 3
**
-
***
P -
**
H
**
(
**
)
1
2
3
4
8
6
9
1
Series name : IT3
2
Receptacle Type
D
: Mating Receptacle
D* : Mating Receptacle ( Customized )
M
: Mounting Receptacle
M* : Mounting Receptacle ( Coustomized )
Interposer Type
Blank: Standard
** : Customized
3
Contact Positions : 100, 180
*
, 200, 300
*180 pos. is 2 columns depopulated version for
higher voltage proof.
4
Connector type
S : Receptacle
P : Interposer
5
BGA : Ball Grid Array
6
Package Specification
Blank : Standard
** : Customized
7
Material and Plating Specification of Receptacle
(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76µm)+Ni(1.5µm)
(57) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76µm)+Ni(1.5µm)
8
Stacking Height (mm)
17, 20, 22, 25, 26, 28, 30, 32, 38, 40
9
Plating Specification of Interposer
(03) : Contact Area : Au(0.76µm)+Ni(1.5µm)
3
IT3 SeriesqHigh-Speed(10
+
Gbps) BGA Mezzanine Connectors
s
Signal Integrity
qPin
assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the
figures below. In the following data, one victim pair and eight aggressor pairs are included.
7
8
9
16
17
18
4
5
6
13
14
15
1
2
3
10
11
12
Mating receptacle side
Signal
Ground
Victim pair
Mounting receptacle side
Aggressor pair
qImpedance
profile at 60ps rise time (20-80%)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are
designed with higher impedance to offset the via’s low impedance.
115
115
115
110
Z (Ohm)
Z (Ohm)
110
Z (Ohm)
S11
95
0
200
400
600
Time (ps)
800
1000
110
105
105
105
100
S11
95
0
200
400
600
Time (ps)
800
1000
100
100
S11
95
0
200
400
600
Time (ps)
800
1000
17mm Height
25mm Height
32mm Height
qDifferential
propagation delay
Stacking Height (mm)
Delay (ps)
17
101.05
25
146.69
32
188.48
4
IT3 SeriesqHigh-Speed(10
+
Gbps) BGA Mezzanine Connectors
qDifferential
Insertion Loss
The differential insertion loss is less than -2dB up to 12GHz.
0
-1
-2
-3
-4
S (dB)
S (dB)
-5
-6
-7
-8
-9
S514
-10
0
5
10
15
20
-10
0
5
10
15
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
S514
20
-10
0
5
10
15
S (dB)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
S514
20
17mm Height
25mm Height
32mm Height
qDifferential
Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to
12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
0
0
0
-10
-10
-10
RL (dB)
RL (dB)
-30
-30
RL (dB)
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-20
-20
-20
-30
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-40
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
15
20
-50
-50
-50
17mm Height
25mm Height
32mm Height
qDifferential
Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as
critical because TX and RX can be grouped into separate wafers.
0
-10
-20
S (dB)
-30
-40
-50
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
0
-10
-20
S (dB)
-30
-40
-50
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
0
5
10
Frequency (GHz)
15
20
17mm Height
25mm Height
32mm Height
5
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