Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I212 / I213
Series
I203 Package
20.7
4
3
Product Features:
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
RoHS Compliant
Applications:
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
12.6
1
2
7.62
15.24
5.1 Max.
Frequency
Output Level
HC-MOS
TTL
Duty Cycle
Rise / Fall Time
Output Load
HC-MOS
TTL
Frequency Stability
Supply Voltage
Current
Control Voltage
Slope
Operating
Storage
51.84 MHz to 170.000 MHz
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
50% ±5%
10 nS Max.*
12.6
6 Min.
0.048
0.36
I202 Package
12.6
4
3
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL
15 pF
See Frequency Stability Table
See Input Voltage Table, tolerance ±10 %
1
2
7.62
7.62
50 mA Max.*
1.65 VDC ±1.5 VDC for Vcc = 3.3 VDC, 2.5 VDC ±2.0 VDC for VCC
= 5.0 VDC
Positive
See Operating Temperature Table in Part Number Guide
-55
°
C to +125
°
C
5.1 Max.
6 Min.
0.48
0.36
Dimension Units: mm
Pin Connection
1 Control Voltage
2 GND
3 Output
4 Vcc
Package
Part Number Guide
Operating
Temperature
1 = 0° C to +70° C
Frequency
Stability
F =
±20
ppm
X =
±30
ppm
B =
±50
ppm
C =
±100
ppm
Sample Part Number: I212-1BC3-56.000 MHz
Pullability
Supply Voltage
Frequency
B =
±50
ppm min.
C =
±100
ppm min.
K =
±150
ppm min.
L =
±200
ppm min.
5 = 5.0 VDC
3 = 3.3 VDC
- 56.000 MHz
I212 -
I213 -
3 = -20° C to +70° C
4 = -30° C to +75° C
2 = -40° C to +85° C
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Frequency, supply, and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
P
age 1
Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I212 / I213
Series
Typical Application:
Pb Free Solder Reflow Profile:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXX (Part Number detail = I203-XXXX-Freq.)
Line 3: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
P
age 2
RF/Wirelessly
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