Microprocessor, 32-Bit, CMOS, CPGA179, CERAMIC, PGA-179
Parameter Name | Attribute value |
Maker | White Microelectronics |
package instruction | CERAMIC, PGA-179 |
Reach Compliance Code | unknown |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 25 MHz |
External data bus width | 32 |
Format | FLOATING POINT |
Integrated cache | NO |
JESD-30 code | S-CPGA-P179 |
low power mode | NO |
Number of DMA channels | |
Number of external interrupt devices | 7 |
Number of serial I/Os | |
Number of terminals | 179 |
On-chip data RAM width | |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
RAM (number of words) | 0 |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal location | PERPENDICULAR |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
WC32P040-25P4M | WC32P040-25Q4M | WC32P040-33P4M | WC32P040-33Q4M | |
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Description | Microprocessor, 32-Bit, CMOS, CPGA179, CERAMIC, PGA-179 | Microprocessor, 32-Bit, CMOS, CQFP184, CERAMIC, QFP-184 | Microprocessor, 32-Bit, CMOS, CPGA179, CERAMIC, PGA-179 | Microprocessor, 32-Bit, CMOS, CQFP184, CERAMIC, QFP-184 |
Maker | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics |
package instruction | CERAMIC, PGA-179 | CERAMIC, QFP-184 | CERAMIC, PGA-179 | CERAMIC, QFP-184 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Address bus width | 32 | 32 | 32 | 32 |
bit size | 32 | 32 | 32 | 32 |
boundary scan | YES | YES | YES | YES |
maximum clock frequency | 25 MHz | 25 MHz | 33 MHz | 33 MHz |
External data bus width | 32 | 32 | 32 | 32 |
Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
Integrated cache | NO | NO | NO | NO |
JESD-30 code | S-CPGA-P179 | S-CQFP-G184 | S-CPGA-P179 | S-CQFP-G184 |
low power mode | NO | NO | NO | NO |
Number of external interrupt devices | 7 | 7 | 7 | 7 |
Number of terminals | 179 | 184 | 179 | 184 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | PIN/PEG | GULL WING | PIN/PEG | GULL WING |
Terminal location | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |