HM9-7644-8 datasheet, PDF - EEWORLD Datasheet

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HM9-7644-8: DescriptionHM9-7644-8; Categorystorage storage; File Size125KB，3 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HM9-7644-8 Overview

HM9-7644-8

HM9-7644-8 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	85 ns
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
memory density	4096 bi
Memory IC Type	OTP ROM
memory width	4
Number of terminals	16
word count	1024 words
character code	1000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX4
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

HM9-7644-8 Related Products

	HM9-7644-8	HM3-7644-5	HM3-7644A-5	HM1-7644-2	HM1-7644-5	HM1-7644-8	HM9-7644-2	HM9-7644-5
Description	HM9-7644-8	HM3-7644-5	IC,PROM,1KX4,TTL,DIP,16PIN,PLASTIC	HM1-7644-2	HM1-7644-5	HM1-7644-8	HM9-7644-2	HM9-7644-5
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	_compli	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli	_compli
Maximum access time	85 ns	60 ns	50 ns	85 ns	60 ns	85 ns	85 ns	60 ns
JESD-30 code	R-XDFP-F16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4096 bi	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	4096 bi
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4
Number of terminals	16	16	16	16	16	16	16	16
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000
Maximum operating temperature	125 °C	70 °C	70 °C	125 °C	70 °C	125 °C	125 °C	70 °C
organize	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DIP	DIP	DIP	DIP	DFP	DFP
Encapsulate equivalent code	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	NO	NO	NO	NO	NO	YES	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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