|
STPCC0366BTC3 |
STPCCONSUMER-S |
STPCC0390BTC3 |
STPCC0310BTC3 |
STPCC0375BTC3 |
Description |
PC Compatible Embeded Microprocessor |
PC Compatible Embeded Microprocessor |
PC Compatible Embeded Microprocessor |
PC Compatible Embeded Microprocessor |
PC Compatible Embeded Microprocessor |
Is it lead-free? |
Contains lead |
- |
- |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
Maker |
STMicroelectronics |
- |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
BGA |
- |
BGA |
BGA |
BGA |
package instruction |
BGA, BGA388,26X26,50 |
- |
PLASTIC, BGA-388 |
PLASTIC, BGA-388 |
PLASTIC, BGA-388 |
Contacts |
388 |
- |
388 |
388 |
388 |
Reach Compliance Code |
_compli |
- |
_compli |
_compli |
_compli |
Other features |
0 TO 100 OPERATING CASE TEMPERATURE |
- |
0 TO 100 OPERATING CASE TEMPERATURE |
0 TO 100 OPERATING CASE TEMPERATURE |
0 TO 100 OPERATING CASE TEMPERATURE |
Address bus width |
32 |
- |
32 |
32 |
32 |
bit size |
32 |
- |
32 |
32 |
32 |
boundary scan |
NO |
- |
NO |
NO |
NO |
Bus compatibility |
PCI; ISA |
- |
PCI; ISA |
PCI; ISA |
PCI; ISA |
maximum clock frequency |
66 MHz |
- |
14.318 MHz |
100 MHz |
14.318 MHz |
External data bus width |
32 |
- |
32 |
32 |
32 |
JESD-30 code |
S-PBGA-B388 |
- |
S-PBGA-B388 |
S-PBGA-B388 |
S-PBGA-B388 |
JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
length |
35 mm |
- |
35 mm |
35 mm |
35 mm |
Number of terminals |
388 |
- |
388 |
388 |
388 |
Maximum operating temperature |
70 °C |
- |
70 °C |
70 °C |
70 °C |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
- |
BGA |
BGA |
BGA |
Encapsulate equivalent code |
BGA388,26X26,50 |
- |
BGA388,26X26,50 |
BGA388,26X26,50 |
BGA388,26X26,50 |
Package shape |
SQUARE |
- |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
- |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3 V |
- |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
2.38 mm |
- |
2.38 mm |
2.38 mm |
2.38 mm |
speed |
66 MHz |
- |
90 MHz |
100 MHz |
75 MHz |
Maximum supply voltage |
3.6 V |
- |
3.75 V |
3.6 V |
3.75 V |
Minimum supply voltage |
3 V |
- |
3.15 V |
3 V |
3.15 V |
Nominal supply voltage |
3.3 V |
- |
3.45 V |
3.3 V |
3.45 V |
surface mount |
YES |
- |
YES |
YES |
YES |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
BALL |
- |
BALL |
BALL |
BALL |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
BOTTOM |
- |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
35 mm |
- |
35 mm |
35 mm |
35 mm |
uPs/uCs/peripheral integrated circuit type |
MULTIFUNCTION PERIPHERAL |
- |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |